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6 Layer FR4 PCB Production Record #FR4-20260418-082

FR4 PCB 6 Layers ENIG (Immersion Gold) Impedance Control 0.2mm vias Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 15 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 25 x 50 mm Copper Weight 1oz
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Mar 25 21:06
Files Ready
Mar 25 21:06
Engineering Review Completed
Mar 25 21:54
Payment down
Mar 26 18:23
Production Started
Apr 07 10:22
Production Completed
Apr 17 21:43
Progress: 0/6
Engineering Review time: 0.8 h Multiple File Revisions
Production time: 10.5d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.7d
Carrier
DHL
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Apr 18 14:28

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 6-layer HDI PCB was manufactured on FR-4 TG150 material with a finished thickness of 1.0 mm and board size of 25 × 50 mm. The build used 0.5 oz outer copper and 1 oz inner layers, 0.2 mm minimum holes, 6 mil line/space, and ENIG finish. Fifteen pieces were produced in 3×1 panel format with laser-drilled blind vias (2-step HDI) and delivered after 100% flying probe testing within the 21-day lead time. The small form factor combined with blind via requirements and controlled impedance on L1 demanded precise stackup design and process parameter control.

 

Multiple DFM issues were resolved during EQ review. Gerber data showed insufficient solder mask bridge width between SMD pads, character placement on openings risking ink adhesion failure, and low copper density on inner layers that could cause resin starvation during lamination. Blind via diameters were confirmed for laser drilling capability, while panelization was optimized from the original layout to a 3×2 arrangement (102 × 93 mm with stamp holes) to reduce material waste and improve handling. Stackup was adjusted using standard in-house TG150 cores and prepregs after material availability confirmation. These solder mask bridge and resin density adjustments were implemented to ensure reliable via formation and surface quality.

 

All fifteen boards passed electrical testing, visual inspection, and final quality checks with stable impedance and clean via structures. The order was shipped with electrical test reports and certificate of conformity, demonstrating consistent results on this compact 6-layer HDI configuration.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-094 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail

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