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Rigid-Flex PCBs

Trusted by global innovators, AIVON provides advanced rigid-flex PCBs for compact, high-performance electronic systems.

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Rigid-Flex PCBs

What is Rigid-Flex PCB?

A rigid-flex PCB combines rigid and flexible circuit layers into a single structure, offering both durability and design flexibility. It allows 3D configurations, reduces connectors, and improves reliability. AIVON's rigid-flex PCBs are ideal for compact, high-performance devices requiring stable signal integrity and mechanical strength.

Features of Rigid-Flex PCBs

High Space Utilization
  • The flexible section of a flex or rigid-flex PCB can be bent, folded, or routed in three dimensions, allowing designers to bypass internal mechanical obstructions and densely packed components. This capability significantly improves internal layout efficiency and reduces the overall product size. For example, in consumer electronics such as smartphones and tablets, using flexible circuits in hinge areas, battery connections, and display modules can reduce device thickness by up to 30%, enabling sleeker and more compact designs. In wearables, flexible PCBs allow electronics to conform to curved surfaces, maximizing space without sacrificing performance.

Excellent Reliability
  • Flexible PCBs enhance system reliability by minimizing the number of solder joints, connectors, and wiring harnesses—common failure points in traditional assemblies. Fewer interconnects can reduce the failure rate by up to 50% during long-term operation. Additionally, the integrated structure of flexible circuits provides strong resistance to vibration, impact, and thermal cycling. These advantages make them highly suitable for automotive-grade applications such as in-vehicle sensors, ADAS cameras, dashboard modules, and engine-bay electronic control units, where durability and stability are critical under harsh operating conditions.

Superior Signal Integrity
  • Fine-pitch traces in the flexible area, often with line width/spacing ≤ 0.1 mm, help minimize signal attenuation and electromagnetic interference. Combined with advanced stack-up design and high-performance materials, flexible PCBs can achieve ±7% impedance control accuracy, ensuring stable signal transmission even at very high frequencies. These characteristics make them ideal for 5G communication infrastructure, high-speed data transmission modules, RF antennas, camera signal lines, and other applications requiring low loss and high-frequency reliability.

Outstanding Environmental Adaptability
  • Flexible PCBs typically use polyimide (PI) substrates, offering exceptional thermal and chemical resistance. PI materials withstand temperatures above 260°C, maintain excellent dimensional stability, and resist corrosion from oils, solvents, and industrial chemicals. When combined with protective surface treatments, such as conformal coatings for dustproof, moisture-proof, and oxidation resistance, flex circuits can reliably operate in harsh environments. They are widely applied in industrial automation equipment (e.g., robots, SMT equipment, high-temperature workshops), aerospace systems, medical implantables, and other devices requiring long-term performance in challenging conditions.

AIVON Rigid-Flex PCB Manufacturing Capabilities

Category Parameter Specification
Product Process Board Types 1–12 layer boards, FPC flexible boards, rigid-flex boards, HDI blind/buried via boards, gold-plated boards, immersion-gold boards
Size Capability Maximum Board Size 250 mm × 700 mm
Board Thickness Maximum Thickness 0.45 ± 0.05 mm
Board Thickness Minimum Thickness 0.051–0.185 ± 0.03 mm
Hole Capability Minimum Finished Hole Size 0.08 mm
Copper Thickness Base Copper Thickness 1/3 oz, 1/2 oz, 1 oz
Trace Capability Minimum Line Width 0.05 mm
Trace Capability Minimum Line Spacing 0.05 mm
Tolerance Trace Tolerance ±10%
Tolerance Hole Size Tolerance +3 mil
Tolerance Outline Tolerance ±0.05 mm
Surface Finish Thickness Gold Plating Ni layer: 1–6 μm; Au layer: 0.03–0.1 μm
Surface Finish Thickness ENIG (Immersion Gold) Ni layer: 1–6 μm; Au layer: 0.03–0.2 μm
Surface Finish Thickness Tin Plating Sn layer: 8–25 μm

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Why Choose AIVON for Rigid-Flex PCB Manufacturing?

Expert Engineering Support
Expert Engineering Support

AIVON's experienced engineers provide one-on-one DFM and stackup design assistance to ensure your rigid-flex PCB meets both mechanical and electrical performance requirements.

Advanced Manufacturing Equipment
Advanced Manufacturing Equipment

Equipped with precision laser drilling, automated lamination, and high-speed routing machines to guarantee tight tolerances and superior interlayer bonding.

Comprehensive Material Options
Comprehensive Material Options

Supports a wide range of materials, including Polyimide, FR4, and hybrid Rogers composites, for optimized flexibility and signal integrity.

Strict Quality Control
Strict Quality Control

Each PCB undergoes multi-stage inspection: AOI, X-ray, E-test, and bend testing to ensure flawless reliability and long-term durability.

High-Mix, Low-to-Mass Production
High-Mix, Low-to-Mass Production

Whether you need small prototypes or full-scale mass production, AIVON's flexible manufacturing lines can adapt to your project needs efficiently.

Global Delivery and On-Time Service
Global Delivery and On-Time Service

With fast lead times and international logistics support, AIVON ensures your rigid-flex PCB projects are delivered on time, every time.

Rigid-flex PCB Applications

Rigid-Flex PCB Design Guidelines

1. Material and Stackup Configuration
Select polyimide for flex areas due to its superior flexibility and thermal stability; use epoxy glass for rigid substrates. Prioritize rolled annealed copper in flexible sections to avoid brittleness from electrodeposited copper. Ensure symmetric layer counts in rigid zones and thin flex stacks (1/2–5 mil) for a minimum dynamic bend radius of 100x material thickness. Consult manufacturers early to confirm material compatibility with environmental factors.
2. Bending and Mechanical Layout
Maintain a minimum bend radius of 12–24x circuit thickness, aligning with copper grain direction to prevent cracks; avoid sharp angles. Design gradual transitions between flex and rigid areas, incorporating support pins or connectors for stress relief. For dynamic flexing, add redundant traces; static bends support up to 20 layers. Use 3D software for bend simulation and test under vibration and cycles for reliability.
3. Routing, Vias, and Shielding
Route traces straight and perpendicular in flex zones with 3–5 mil widths, staggering across layers; employ curved corners and teardrops at junctions. Confine vias and through-holes to rigid areas to avoid fractures. Use cross-hatched ground planes instead of solid copper for EMI shielding while preserving flexibility. Place components on rigid sections, optimizing high-frequency signals with blind/buried vias.
4. Components and Manufacturing Best Practices
Avoid components in bend areas, favoring rigid supports for stability; ensure even distribution for double-sided assembly. Adhere to IPC-2223 standards and conduct DFM reviews to optimize panel nesting. Prototype testing in real environments with ±0.002, tolerances is essential. Early collaboration with fabricators can reduce costs by up to 20%.

Rigid-Flex PCBs FAQs

Q1: Why is the cost generally higher than a standard rigid PCB?
  • A1: The higher cost is due to the increased complexity of the manufacturing process, which involves unique steps like differential etching, complex multi-layer lamination of dissimilar materials, and rigorous testing protocols for both rigid and flexible sections. The specialized flexible materials themselves are also more expensive than standard rigid materials.
Q2: What is the lead time for rigid-flex PCB production?
  • A2: Lead time depends on complexity and volume—typically 7–15 working days for prototypes and 2–4 weeks for mass production orders.
Q3: What are the advantages of rigid-flex PCBs?
  • A3:They offer excellent space efficiency, mechanical stability, and design flexibility, reducing the need for connectors and improving signal integrity.

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