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High TG PCBs for Extreme Reliability

Superior Thermal Stability, Low Expansion, and Moisture Resistance for High-Performance Electronics

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High TG PCBs for Extreme Reliability

What is High TG PCB?

High TG PCBs feature a substrate Tg ≥170°C, offering excellent thermal stability, low Z-axis expansion, and superior moisture resistance. They withstand lead-free soldering at 260°C and perform reliably in high-temperature, high-pressure environments. Ideal for automotive ECUs, 5G base stations, and industrial inverters, these PCBs provide a robust foundation for high-performance and high-reliability electronic devices.

AIVON High TG PCB Solutions

12-layer High TG Heavy Copper PCB with ENIG Finish
  • A technologically advanced multilayer printed circuit board designed for high-reliability and high-performance applications

    Layers: 12

    Board Thickness: 2.0 mm

    Solder Mask: Matte Black

    Minimum Hole Size: 0.2 mm

New Energy Storage PCB
  • 4-layer ENIG PCB for Renewable Energy Applications

    Used in lithium battery storage, photovoltaic (PV) energy storage, and wind power storage systems.

    Layers: 4

    Material: FR4

    Board Thickness: 1.6 mm

    Surface Finish: ENIG (Electroless Nickel Immersion Gold)

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Advantages of AIVON's High TG PCB

Excellent Mechanical Strength
Excellent Mechanical Strength

Maintains strong mechanical stability even at high temperatures, resisting external stress effectively.

Superior High-Frequency Performance
Superior High-Frequency Performance

Low dielectric constant and low dissipation factor ensure minimal signal delay and high signal integrity in high-frequency transmission.

Enhanced Dimensional Precision
Enhanced Dimensional Precision

The high TG material minimizes thermal expansion differences between layers, supporting multilayer designs with fine traces and tight tolerances, crucial for aerospace, military, and high-power electronics.

Reliable in Harsh Environments
Reliable in Harsh Environments

Performs exceptionally under extreme temperature changes and humidity, suitable for demanding applications such as military and aerospace.

Environmental Compliance
Environmental Compliance

Meets RoHS and other environmental standards, helping to reduce ecological impact.

Optimized Signal Transmission
Optimized Signal Transmission

Advanced materials and precise fabrication reduce signal loss and crosstalk, supporting high-speed and high-frequency circuits with consistent performance in critical applications.

Application of High TG PCBs

Key Design Considerations for High TG PCBs

When designing High TG PCBs, focus on thermal management, material selection, and layer structure to ensure reliability under high temperatures. Use substrates with TG ≥170°C, low CTE, and good moisture resistance to prevent warping and delamination.
Maintain symmetrical layer stacking and choose suitable copper thickness for stable heat distribution. Ensure compatibility with lead-free soldering (up to 260°C) and apply finishes such as ENIG or OSP for better durability. Proper testing and quality control help achieve long-term performance in automotive, industrial, and communication applications.

High TG PCB FAQs

Q1: Do AIVON provide different solder mask options for industrial high TG PCBs?
  • A1: Yes. AIVON offers various solder mask options for industrial-grade High TG PCBs, including glossy or matte finishes in colors such as green, black, blue, white, and red. For high-temperature or special applications, we also provide high-heat-resistant and low-reflectivity solder mask materials to ensure durability and optimal performance.
Q2: What is the TG value?
  • A2: TG (Glass Transition Temperature) is the temperature at which a PCB’s base material changes from a rigid, glassy state to a soft, rubbery state. A higher TG value means the board can withstand higher operating and soldering temperatures, offering better thermal stability, mechanical strength, and reliability under stress.
Q3: What is the difference between TG and TD PCB?
  • A3: TG refers to the point where the material begins to soften. TD is the point where the material starts to chemically decompose and lose its structural integrity. TG affects thermal stability, while TD determines the upper thermal limit. For high-temperature or lead-free soldering environments, both TG and TD should be considered to ensure long-term reliability.

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