Engineered for superior alignment, smooth paste release, and minimal defects in fine-pitch SMT applications.
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A SMD stencil (Surface Mount Device stencil), also known as a solder paste stencil, is a thin sheet of stainless steel or nickel with laser-cut openings that match the pads on a printed circuit board (PCB). Its primary purpose is to accurately apply solder paste onto the PCB's surface before placing surface-mount components during the SMT (Surface Mount Technology) assembly process.
This stencil does not include a permanent metal frame. It can be used with a universal frame or fixed manually for printing. It is widely used in prototype builds and small volume assembly because it reduces cost while still providing acceptable printing quality. Engineers appreciate its lightweight design, convenient storage, and fast replacement during frequent design revisions. Although it requires more manual handling, its flexibility makes it suitable for teams that update PCB layouts often.
This stencil does not include a metal frame. It can be clamped manually or installed in a universal frame system. It is a popular option for prototype builds or small batches because it reduces material cost while still providing good printing performance. Its lightweight structure makes it easy to store and ship. Although it requires more manual handling, it remains suitable for most standard PCB printing needs.
This stencil is specifically created for manual solder paste application in early development. Engineers use it for quick experiments, proof of concept builds, and small engineering trials. It does not require an automatic printer. A simple hand tool is enough to apply paste across the openings. This reduces preparation time and allows rapid iteration during debugging. It is also useful in R and D laboratories because it enables teams to verify component spacing, pad design, and assembly behavior without committing to full production tooling.
This stencil contains regions with different thickness values to control paste volume with greater precision. Boards that mix very small components with high power packages often require varied paste height. A step stencil allows engineers to reduce paste in fine pitch areas and increase paste under larger pads. This targeted control helps prevent solder bridging, tombstoning, and insufficient solder. It is often used for dense boards, power management sections, and modules with multiple package sizes. By optimizing paste distribution, it supports stable reflow quality across complex PCB layouts.
This stencil is produced using laser technology that creates smooth aperture walls and uniform edges. These clean openings allow paste to release more consistently during printing. The technique supports fine pitch pads, micro components, and high density layouts where dimensional accuracy is critical. Laser cutting also improves repeatability, which helps maintain predictable results across multiple production batches. It is commonly selected for advanced electronic devices, compact consumer products, and assemblies with Mini LED or high I O count components.
AIVON ensures clean aperture edges and consistent solder paste printing. Processed with advanced laser cutting equipment featuring a precision of ±20 μm. Equipped with an original IPG laser source, capable of cutting thicknesses ranging from 0.03 mm to 0.3 mm.
Made from genuine 304 stainless spring steel, featuring excellent corrosion resistance, oxidation resistance, rust prevention, and high toughness.
Customers can easily upload Gerber files for custom stencil production. AIVON supports both framed and frameless options with rapid delivery, helping manufacturers shorten assembly preparation time.
AIVON's stencils maintain perfect flatness and tightness during high-speed printing. Uses a high-tension aluminum frame with AB resin adhesive to ensure stable and durable tension performance.
AIVON's stencils maintain perfect flatness and tightness during high-speed printing. Removes slag and burrs from the apertures, increasing surface friction to improve solder paste rolling and ensure smooth, consistent paste release.
Each stencil undergoes strict inspection to ensure precision and consistency. With AIVON's reliable quality and long stencil lifespan, users benefit from fewer defects, higher yield, and lower overall production costs.
SMD stencils play a vital role in the assembly of consumer electronics such as smartphones, tablets, laptops, and wearable devices. By ensuring accurate solder paste deposition, they help achieve high production efficiency, consistent solder joints, and stable device performance.
Automotive systems demand components that can withstand vibration, heat, and long-term operation. SMD stencils ensure uniform solder paste thickness and strong solder joints in ECUs, sensor modules, and infotainment systems, improving overall reliability.
SMD stencils are essential in manufacturing control boards and automation systems. They guarantee consistent solder paste placement, allowing industrial machinery and robotics to operate with accuracy and durability.
In the medical field, precision and reliability are critical. SMD stencils enable accurate solder paste application for compact PCBs used in medical monitoring systems, diagnostic instruments, and implantable devices, supporting both safety and functionality.
In aerospace and defense electronics, every connection must be dependable under extreme environmental conditions. High-quality SMD stencils help achieve precision soldering for navigation systems, radar modules, and avionics, ensuring long-term stability and performance.
For telecommunications and networking products, including routers, base stations, and 5G modules, SMD stencils enable fine-pitch soldering of high-density PCBs. This ensures reliable signal transmission and superior electrical performance.
Choose standard, step, or patterned apertures to control solder volume. Large thermal pads benefit from a grid of smaller openings to ensure proper solder release and reduce voids. Align apertures with component terminals for consistent paste deposition.
Proper paste volume is essential to avoid open joints or bridging. Adjust aperture size or stencil thickness and apply reduction factors for fine-pitch components. Use stainless steel or electroformed stencils for precise openings and maintain cleanliness for consistent results.
Coordinate stencil design with PCB layout, including component spacing and fiducials, to ensure accurate alignment and uniform paste printing. Validate designs using solder paste inspection and adjust if defects are observed.
