| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 20 pcs |
| Layers | 1 Layers | Board Type | Single PCB |
| Dimensions | 52 x 40 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | HASL Lead Free | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | None |
| Stack-up | Custom | Impedance Control | No |
This production record covered 80 panels of standard 4-layer FR4 PCB with 1.6 mm finished thickness, 1 oz copper on all layers, and 6/6 mil minimum trace and spacing. Board size was 140 × 100 mm. The design used conventional parameters that required no impedance control, allowing standard multilayer lamination and mechanical drilling to proceed without modification. After engineering review and material preparation, circuit imaging and etching produced clean inner and outer layer patterns with consistent etch factors.
Solder mask was applied and cured prior to molten solder coating and hot air leveling, delivering a uniform lead-free HASL surface. The process sequence ensured adequate solder thickness on pads while maintaining flatness suitable for automated assembly. Every panel then completed full electrical testing to verify net continuity and isolation.
The complete order was finished in 1.3 days. Resulting boards showed stable solder mask registration, even tin distribution after leveling, and repeatable dimensional stability, confirming reliable execution for this conventional multilayer specification.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260430-043 | FR4 PCB | 6 | 171.2 x 305 | Green | HASL Lead Free | 5 | View detail |
| FR4-20260429-022 | FR4 PCB | 6 | 80 x 200 | Green | HASL Lead Free | 25 | View detail |
| FR4-20260407-029 | FR4 PCB | 4 | 150 x 120 | Green | HASL Lead Free | 10 | View detail |