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2 Layer Rogers PCB Production Record #ROG-20260310-012

Rogers PCB 2 Layers Immersion Silver RO4350B Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type Rogers PCB Quantity 15 pcs
Layers 2 Layers Board Type Single PCB
Dimensions 35.6 x 120.7 mm Copper Weight 1oz
Thickness 0.254 mm Min Track / Spacing 5/5mil
Surface Finish Immersion Silver Min Hole Size 0.25mm
Solder Mask Green Silkscreen White
Material Type Rogers/RO4350B

Manufacturing Timeline

Order Created
Feb 09 12:13
Files Ready
Feb 09 12:13
Engineering Review Completed
Feb 09 12:35
Payment down
Feb 24 02:15
Production Started
Feb 24 02:19
Production Completed
Mar 05 22:55
Progress: 0/6
Engineering Review time: 0.4 h Multiple File Revisions
Production time: 9.9d With Engineering Questions

Logistics Information

Production Completed→Shipping : 4.8d
Carrier
FedEx IP
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Mar 10 17:12

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Rogers Material Preparation
04
Circuit Imaging & Etching
05
Low Loss Material Lamination
06
Solder Mask Application
07
Electrical Testing

Manufacturing Summary

 

This 2-layer high-frequency board measured 35.6 × 120.7 mm with 1 oz copper on both sides and a thin 0.254 mm finished thickness using Rogers RO4350B material. Produced as single pieces in a quantity of 15, the design featured 5 mil line/space, immersion silver surface finish, and no process edges. No blind vias were present, with mechanical forming and 100% flying probe testing. The combination of Rogers substrate, tight geometry, and edge proximity presented the main production considerations.

 

DFM review confirmed multiple file details including inconsistent slot dimensions between layers and non-plated hole designations where circuit features existed. Copper features and pads positioned very close to the board outline risked edge exposure during routing. Vias located directly on IC pads raised concerns for potential voids and solder joint reliability, prompting discussion of resin plugging. The absence of bottom solder mask on Rogers material was noted for possible yellowing. Edge clearance adjustments and file confirmations were implemented to balance design intent with manufacturability. Rogers material edge clearance handling was applied to minimize copper exposure while preserving electrical performance.

 

Production completed successfully within 14 days, delivering boards that met dimensional, electrical, and surface finish requirements. The thin high-frequency panels maintained stability throughout processing and testing, supporting reliable RF performance for this order.

 

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action

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