| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Aluminum PCB | Quantity | 20 pcs |
| Layers | 1 Layers | Board Type | Panel PCB |
| Dimensions | 194 x 279.6 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 10/10mil |
| Surface Finish | HASL Lead Free | Min Hole Size | 1.5mm↑ |
| Solder Mask | White | Silkscreen | Black |
| Thermal Conductivity | 1.0W | Voltage Withstand | AC2500V |
These 20 aluminum PCBs were produced as panels measuring 194 × 279.6 mm with a 1.6 mm total thickness and 1.0W thermal conductivity base. The single-layer design used 1 oz copper, 10/10 mil track spacing, 1.5 mm minimum holes, white soldermask, black silkscreen, and HASL Lead Free surface finish while meeting AC 2500V withstand requirements. This combination prioritizes heat dissipation without pushing the geometry into tight-tolerance territory, allowing standard processing parameters to deliver consistent thermal transfer across the batch.
Material preparation began with the aluminum substrate to preserve its thermal properties, followed by circuit imaging and etching to define the conductive pattern. Thermal insulation lamination bonded the dielectric layer uniformly, after which solder mask application and molten solder coating were completed prior to hot air leveling. Heat dissipation control steps were applied during lamination and surface finishing to prevent any distortion of the metal core or degradation of the 1.0W conductivity rating.
The full order completed electrical testing without deviation and shipped within 1.4 days. Every panel exhibited even HASL coverage and reliable dielectric integrity, confirming the boards will perform as expected in heat-generating assemblies.
Detailed technical examination of processes required to manufacture reliable aluminum substrate boards with HASL surface finish for thermal management applications.
Discover real factory insights on common engineering queries for HASL Aluminum PCB and OSP Aluminum PCB. As a senior PCB manufacturing engineer, I explain material-specific DFM challenges, surface finish conflicts with aluminum substrates, thermal management issues, and practical solutions to reduce EQs and improve production yield
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| ALU-20260524-021 | Aluminum PCB | 1 | 130 x 240 | Warm White | HASL Lead Free | 20 | View detail |
| ALU-20260420-036 | Aluminum PCB | 1 | 240 x 135 | White | HASL Lead Free | 200 | View detail |
| ALU-20260418-057 | Aluminum PCB | 1 | 36.9 x 36.73 | White | HASL Lead Free | 200 | View detail |