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6 Layer FR4 PCB Production Record #FR4-20260117-014

FR4 PCB 6 Layers HASL Lead Free Impedance Control Heavy Copper Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 15 pcs
Layers 6 Layers Board Type Single PCB
Dimensions 73 x 41 mm Copper Weight 4oz
Thickness 2 mm Min Track / Spacing 10/10mil
Surface Finish HASL Lead Free Min Hole Size 0.3mm↑
Solder Mask Black Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Jan 05 09:58
Files Ready
Jan 05 09:58
Engineering Review Completed
Jan 05 10:38
Payment down
Jan 06 10:29
Production Started
Jan 06 10:31
Production Completed
Jan 17 14:48
Progress: 0/6
Engineering Review time: 0.7 h
Production time: 11.2d

Logistics Information

Production Completed→Shipping : 1.1 h
Carrier
DHL
Destination
CANADA
Shipping Method
Express Air
Shipping Time
Jan 17 15:48

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Thick Copper Electroplating
08
Controlled Copper Etching
09
Solder Mask Application
10
Molten Solder Coating
11
Hot Air Leveling
12
Electrical Testing

Manufacturing Summary

This production record covered a standard 4-layer FR4 PCB with heavy copper weight of 3oz on the outer layers and 2oz inner layers. Panels measured 280mm × 220mm with a finished board thickness of 2.4mm. The design specified 7/7 mil trace and spacing, 0.35mm minimum hole size, and HASL Lead Free surface finish to support elevated current requirements while maintaining standard fabrication compatibility.

Engineering review focused on plating distribution across the thick copper features. Following material preparation, inner layer imaging and circuit etching were completed before layer stack alignment and high pressure lamination. Thick copper electroplating required extended bath cycles to reach target weight, after which controlled copper etching preserved trace profiles and avoided excessive undercut on the heavier foil.

Solder mask application, molten solder coating, and hot air leveling produced a consistent surface topography suited to the board’s power delivery needs. Full electrical testing verified net continuity and isolation on every panel. The complete sequence took 11.2 days and yielded boards that met all dimensional and performance criteria without deviation.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260430-043 FR4 PCB 6 171.2 x 305 Green HASL Lead Free 5 View detail
FR4-20260429-022 FR4 PCB 6 80 x 200 Green HASL Lead Free 25 View detail

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