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6 Layer FR4 PCB Production Record #FR4-20260204-042

FR4 PCB 6 Layers HASL Lead Free Yes Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 43.75 x 116.88 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish HASL Lead Free Min Hole Size 0.4mm
Solder Mask Black Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Jan 07 22:03
Files Ready
Jan 07 22:03
Engineering Review Completed
Jan 12 11:15
Payment down
Jan 12 11:05
Production Started
Jan 12 11:21
Production Completed
Jan 14 22:42
Progress: 0/6
Engineering Review time: 4.6d Multiple File Revisions
Production time: 2.5d With Engineering Questions

Logistics Information

Production Completed→Shipping : 20.8d
Carrier
FedEx IP
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Feb 04 17:52

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Molten Solder Coating
09
Hot Air Leveling
10
Electrical Testing

Manufacturing Summary

This production record details a standard 4-layer FR4 PCB run using 1.6 mm finished thickness and 1 oz copper weight across all layers. The design called for 0.3 mm minimum hole size together with 6 mil trace width and spacing, placing the geometry in conventional territory that our etching and drilling parameters handle routinely. Material preparation fed directly into inner layer imaging, circuit imaging and etching, followed by careful layer stack alignment and high pressure lamination to secure registration across the stackup.

Solder mask application preceded molten solder coating and hot air leveling, producing a consistent HASL Lead Free surface finish suited to both through-hole and surface-mount assembly. Electrical testing at completion verified continuity and isolation on every net, confirming the boards met all specified requirements without rework. The absence of impedance control or finer geometries allowed the line to maintain standard process speeds while still delivering uniform copper distribution and laminate integrity.

Completed in 2.5 days from initial engineering review to final packed panels, the order left the floor with stable thickness tolerance and clean edge definition. These execution details provide customers with multilayer PCBs that perform reliably in standard operating environments.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260318-006 FR4 PCB 6 330 x 80 Green HASL Lead Free 25 View detail
FR4-20260314-020 FR4 PCB 2 570 x 20 Matte Black HASL Lead Free 10 View detail
FR4-20260311-008 FR4 PCB 6 184 x 92 Green HASL Lead Free 25 View detail

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