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2 Layer FR4 PCB Production Record #FR4-20260314-020

FR4 PCB 2 Layers HASL Lead Free Heavy Copper Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 10 pcs
Layers 2 Layers Board Type Single PCB
Dimensions 570 x 20 mm Copper Weight 3oz
Thickness 4 mm Min Track / Spacing 10/10mil
Surface Finish HASL Lead Free Min Hole Size 0.5mm
Solder Mask Matte Black Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Feb 02 07:04
Files Ready
Feb 02 07:57
Engineering Review Completed
Payment down
Feb 02 07:05
Production Started
Mar 02 14:51
Production Completed
Mar 13 19:34
Progress: 0/6
Production time: 11.2d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.8d
Carrier
FedEx IP
Destination
SWEDEN
Shipping Method
Express Air
Shipping Time
Mar 14 14:21

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Thick Copper Electroplating
05
Controlled Copper Etching
06
Solder Mask Application
07
Molten Solder Coating
08
Hot Air Leveling
09
Electrical Testing

Manufacturing Summary

This 2-layer FR-4 board (570 × 20 mm, 4.0 mm finished thickness) was produced as 10 pieces using KB-6165F TG150 material with 1 oz / 3 oz copper. The long narrow aspect ratio required careful handling during processing. Key specifications included 0.5 mm minimum holes, 10 mil line width/space, lead-free HASL surface finish, and via tenting. Production was completed in 16 days with 100% flying probe testing, electrical test reports, and quality certificates delivered.

Given the 4 mm thickness and single-piece shipment requirement, production used a 10-up panel with stamp hole connections (0.8 mm holes at 0.25 mm spacing) for stability. Tooling holes (2.0 mm) and fiducials (1.0 mm) were added on process edges 5 mm from the board outline. The 0.4 mm vias specified for tenting were pre-drilled to 0.6 mm to reduce the risk of ink intrusion and solder bead entrapment in the high aspect ratio holes. NPTH hole size was confirmed at 8.05 mm with adjusted routing tolerance of ±0.1 mm. Thickness tolerance followed IPC ±10%, and production numbering was placed as requested.

All DFM clarifications were resolved before release, resulting in boards that met dimensional, plating, and electrical requirements with clean edges after depanelization. For detailed handling of the via tenting and panelization approach in this 4 mm thick build, refer to the related engineering case.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail
FR4-20260425-090 FR4 PCB 2 406.4 x 660.4 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260423-049 FR4 PCB 2 179 x 158.3 Green ENIG (Immersion Gold) 20 View detail

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