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4 Layer FR4 PCB Production Record #FR4-20260427-053

FR4 PCB 4 Layers ENIG (Immersion Gold) Impedance Control Heavy Copper Small Volume
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 125 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 96.1 x 187 mm Copper Weight 3oz
Thickness 1.2 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Feb 13 17:18
Files Ready
Feb 13 17:18
Engineering Review Completed
Feb 13 18:20
Payment down
Mar 10 23:57
Production Started
Apr 10 17:16
Production Completed
Apr 27 19:25
Progress: 0/6
Engineering Review time: 1h Multiple File Revisions
Production time: 17.1d With Engineering Questions

Logistics Information

Production Completed→Shipping : 1 min
Carrier
FedEx IP
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Apr 27 19:26

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Thick Copper Electroplating
08
Controlled Copper Etching
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Electrical Testing

Manufacturing Summary

This 4-layer heavy copper FR-4 board (96.1 × 187 mm, 1.2 mm finished thickness) was produced in a batch of 500 pieces (125 sets) using Shengyi S1000H TG150 material with 3 oz copper on both inner and outer layers. The design featured 0.3 mm minimum holes, 6 mil line width/space, ENIG surface finish, resin-plugged vias, and V-CUT plus milling for depanelization. Production followed a 21-day lead time with 100% flying probe testing, electrical test reports, quality certificates, and microsection analysis delivered.

 

DFM review addressed several critical points. SMT pads positioned close to the heavy copper board edge risked partial removal during V-CUT; pad-to-edge clearances were verified and confirmed. Four plated slots missing from the latest data were restored per the original PLATED_MILLING file. Solder mask openings were adjusted per customer instructions—full pad size for connector holes and original pad size plus 1 mil for others to compensate for ink flow—while confirming resin plugging scope for all vias including any vent holes. Stack-up was built from available cores and prepregs after customer approval, with L3 copper network connectivity clarified before release. Production numbering and date code marking were added on the process edge and top solder mask respectively for traceability.

 

All plated slots were executed as specified with copper. The final boards passed electrical and microsection requirements with consistent copper thickness and reliable via fill. For detailed handling of the V-CUT pad damage risk and plated slot clarifications in this 3 oz heavy copper build, refer to the related engineering case.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-094 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail
FR4-20260425-090 FR4 PCB 2 406.4 x 660.4 Matte Black ENIG (Immersion Gold) 5 View detail

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