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2 Layer FR4 PCB Production Record #FR4-20260425-090

FR4 PCB 2 Layers ENIG (Immersion Gold) Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 2 Layers Board Type Single PCB
Dimensions 406.4 x 660.4 mm Copper Weight 1oz
Thickness 3 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.4mm
Solder Mask Matte Black Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Mar 13 23:07
Files Ready
Mar 13 23:07
Engineering Review Completed
Mar 13 23:49
Payment down
Mar 26 10:05
Production Started
Apr 03 11:19
Production Completed
Apr 25 04:39
Progress: 0/6
Engineering Review time: 0.8 h
Production time: 21.8d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.6d
Carrier
DHL
Destination
CANADA
Shipping Method
Express Air
Shipping Time
Apr 25 17:42

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Solder Mask Application
05
Electroless Nickel Deposition
06
Immersion Gold Deposition
07
Electrical Testing

Manufacturing Summary

This 2-layer FR-4 board was produced with overall dimensions of 406.4 × 660.4 mm and a finished thickness of 3.0 mm, using TG150 material and 1 oz copper on both sides. With a relatively large panel size and substantial board thickness, particular attention was paid to material handling, flatness control during lamination, and mechanical processing to maintain dimensional stability. The order was delivered as 5 single pieces with ENIG surface finish, 0.4 mm minimum hole size, and 6 mil line/space geometry. All boards underwent 100% flying probe testing prior to shipping.

 

During DFM review and EQ communication, several clarifications were required. The customer-specified countersunk holes (8.63 mm at 82°) were adjusted to the available 8.6 mm at 90° tool after confirmation; depth and placement were verified against the provided documentation to ensure functional fit. Copper weight requirements were aligned between the noted 0.5 oz base and finished target, while QR code placement, orientation, and white ink contrast on the solder mask block were resolved to maintain readability. Marking text “(C)DRAGANFLY 2025” was removed per final customer instruction. These countersunk hole and marking coordination steps were documented to prevent downstream assembly issues.

 

Production followed standard 14-day lead time with mechanical forming and full electrical verification. All five boards passed final inspection and were shipped with electrical test reports and certificate of conformity. The order demonstrated consistent thickness control and hole quality on this thick, large-format 2-layer configuration.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-094 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail

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