| Item | Category | Capability Parameters | ||
|---|---|---|---|---|
| Standard Capability | Sample Capability | |||
| Product Type |
Any-layer Interconnect | / | yes | yes |
| HDI Structure | / | 3+N+3 | 6+N+6 | |
| Layer Count | / | 16 layers | 20 layers | |
| Surface Finish | / | HASL (Leaded/Lead-free), ENIG, OSP, Bare Copper, Immersion Tin, Immersion Silver, ENIG + Gold Plated Fingers, HASL + Gold Plated Fingers, ENIG + OSP | ||
| Special Process Boards | / | Half-holes, Resin Plugging, Countersink Holes, Step Slots, Depth-controlled Slots, Back-drilling, Embedded Resistors, Embedded Capacitors, Embedded Copper Blocks, Metal Edge Plating, Laser-engraved QR Codes | ||
| Base Material | Material Type | FR-4 (Halogenated & Halogen-free), High-frequency, High-speed Materials | ||
| Material Suppliers | Kingboard, Nan Ya, Shengyi, ITEQ, Rogers, Panasonic, Arlon, Isola | |||
| Board Thickness | Max. Production Thickness | / | 3.2mm | 3.2mm |
| Min. Production Thickness | / | 0.3mm | 0.2mm | |
| Thickness Tolerance | Thickness < 0.5mm | ± 0.05mm | ± 0.04mm | |
| 0.5mm ≤ Thickness < 0.8mm | ±10% | ±10% | ||
| 0.8mm ≤ Thickness ≤ 1.0mm | ± 0.08mm | ± 0.08mm | ||
| 1.0mm < Thickness ≤ 1.6mm | ±0.1mm | ±0.1mm | ||
| 1.6mm < Thickness ≤ 2.3mm | ±0.16mm | ±0.13mm | ||
| Copper Thickness | Max. Inner Layer Copper | / | 3OZ | 5OZ |
| Max. Outer Layer Copper | / | 4OZ | 6OZ | |
| Lamination | Layer-to-layer Registration | / | Max. Misalignment ≤ 50um | Max. Misalignment ≤ 50um |
| Copper Foil Thickness | / | 1/3oz, 1/2oz, 1oz, 1.5oz, 2.0oz | 2.5oz, 3oz | |
| Common PP Lamination Capability | / | 7628/2116/1080/106/3313/1067 | 1027/1017/1037 (IC Substrate Only) | |
| PP Dielectric Thickness Tolerance After Lamination | 7628 | ±10% | / | |
| 2116 | ±10% | / | ||
| 1080 | ±10% | / | ||
| 3313 | ±10% | / | ||
| 106 | ±10% | / | ||
| 1067 | ±10% | / | ||
| 1037 | ±15% | / | ||
| 1027 | ±15% | / | ||
| 1017 | ±15% | / | ||
| Laser Drilling | Hole Position Accuracy | / | ≤10um | / |
| Min. Blind Via Diameter | / | 70um | 60um | |
| Drillable Hole Diameter (Surface Cu 9um, Aspect Ratio ≤ 1:1) | Hole Diameter | PP Type | Min. Pad Size | |
| 60um | 1017/1027/1037 | 110um | ||
| 70um | 1017/1027/1037/106/1067 | 120um | ||
| 80um | 1017/1027/1037/106/1067 | 130um | ||
| 90um | 1027/1037/106/1067 | 140um | ||
| 100um | 106/1067/1078/1080 | 150um | ||
| 110um | 106/1067/1078/1080 | 160um | ||
| 120um | 106/1067/1078/1080/106+106 | 170um | ||
| 150um | 1080/106+106/1080+106/1080+1080 | 200um | ||
| Open-window Blind Vias (Surface Cu ≥ 13um, Aspect Ratio ≤ 1:1) | 60–150um | Refer to Brown-oxide Blind Vias | Refer to Brown-oxide Blind Vias | |
| 151–300um | Single layer ≤ 2116; multi-layer stack each layer ≤ 1080 | / | ||
| > 300um | Single layer ≤ 2116; multi-layer stack each layer ≤ 1080 | / | ||
| Mechanical Drilling | Hole Diameter | Min. Single Round Hole Diameter | 0.15mm | 0.1mm |
| Max. Single Round Hole Diameter | 6.5mm | 6.5mm | ||
| Min. Slot Drill Diameter | 0.5mm | 0.4mm | ||
| Inner Corner Radius of Square Slot | 0.4mm | 0.4mm | ||
| Hole Diameter Tolerance | Single Round NPTH Hole | ±50um | ±38um | |
| Single Round PTH Hole | ±76um | ±50um | ||
| Reamed Round Hole (NPTH) | ±76um | ±76um | ||
| Reamed Round Hole (PTH) | ±100um | ±76um | ||
| Countersink Hole Diameter (at Opening) | ±152um | ±127um | ||
| Slot Width (PTH) | ±76um | ±50um | ||
| Slot Width (NPTH) | ±50um | ±38um | ||
| Slot Length Tolerance | Long Slot (Length ≥ 2× Width) | ±76um | ±76um | |
| Short Slot (Length < 2× Width) | ±4mil | ±76um | ||
| Hole Position Accuracy | 1st Drill Position Accuracy | ±76um | ±50um | |
| 2nd Drill Position Accuracy | ±76um | ±50um | ||
| Hole Edge-to-edge Spacing | Different Nets | ≥254um | 254um > L ≥ 200um (Use CAF-resistant Material) | |
| Same Net | ≥200um | 200um > L ≥ 152um (Note near-hole in MI, add dust-extraction re-drill) | ||
| Slot Length Tolerance | Long Slot (Length ≥ 2× Slot Width) | ±76um | ±76um | |
| Short Slot (Length < 2× Slot Width) | ±100um | ±76um | ||
| Back-drilling | Depth Tolerance | ±100um | ±76um | |
| Countersink Hole | Angle | 90º, 135º, 165º | 90º, 135º, 165º | |
| Electroplating | Horizontal Electroless Copper | Production Thickness Range | 0.05-3.5mm | / |
| Blind Via Diameter / Aspect Ratio | 60-200um / 0.8:1 (Blind via count ≤ 4 million, Mini-LED) | 1:1 | ||
| Min. Hole Diameter / Aspect Ratio | 0.2mm hole / 8:1 | 10:1 | ||
| 0.1mm hole / 5:1 | 8:1 | |||
| Via-filling VCP | Production Thickness Range | 0.05-3.5mm | / | |
| Through-hole Aspect Ratio | 8:1 (Hole Dia. 0.1mm) | / | ||
| Throwing Power | TP ≥ 70% (Aspect Ratio ≤ 5:1) | / | ||
| TP ≥ 50% (Aspect Ratio ≤ 8:1) | / | |||
| Surface Copper Standard Deviation | 4um | / | ||
| Blind Via Aspect Ratio | 0.8:1 (60-200um) | 1:1 | ||
| Through-hole VCP | Production Thickness Range | 0.3-3.5mm | / | |
| Aspect Ratio | 8:1 (Through-hole Dia. 0.1mm) | / | ||
| Throwing Power | TP ≥ 80% (Aspect Ratio ≤ 6:1) | / | ||
| TP ≥ 68% (Aspect Ratio ≤ 8:1) | / | |||
| Resin Plugging | Production Thickness Capability | Minimum | 0.3mm | 0.2mm |
| Maximum | 3.0mm | 3.2mm | ||
| Vacuum Plugging | Plugging Fullness | ≥95% | ≥100% | |
| Plugging Hole Diameter (Drill Bit) | 0.15-0.55mm | 0.1-0.6mm | ||
| Plugging Aspect Ratio | ≦12:1 | ≦14:1 | ||
| Plugging Hole Spacing | ≥0.5mm | / | ||
| Grinding | Copper Removal by Grinding | Surface Cu: 3-4um; Hole Edge: 3-7um (Dia. ≥ 2.5mm) | / | |
