Engineering Cases
Engineering Cases focuses on real PCB engineering reviews, manufacturing challenges, and production optimization processes from actual fabrication projects. This category highlights how different PCB designs are evaluated and adjusted during engineering review, covering topics such as stack-up analysis, impedance control, drill optimization, copper balancing, solder mask alignment, DFM review, and production risk assessment across various PCB applications. The content in this section is based on practical manufacturing scenarios rather than theoretical introductions. Each engineering case demonstrates how specific PCB issues are identified, analyzed, and resolved during production preparation and fabrication. These records help engineers, purchasers, and hardware teams better understand the relationship between PCB design decisions and manufacturing stability, yield control, and process reliability. Topics may include multilayer PCB engineering review, HDI process optimization, flexible PCB manufacturing considerations, heavy copper processing adjustments, surface finish selection, Gerber data verification, and other real-world PCB production experiences. By organizing engineering challenges and process solutions into structured case content, this category provides valuable insight into practical PCB manufacturing and engineering workflow management.
Featured Blog
PCB Stackup, Impedance and Thickness Issues in CAM Review
When PCB stackup, impedance, and board thickness notes disagree, CAM cannot book one press-up. See stock, Z-trace, copper-weight, and thickness conflicts—and what to lock before build.
Latest Blogs
PCB CAM Case Study on Tight Tolerances in Backdrilling, Countersink, and Press-Fit Holes
How PCB CAM reviews a tight backdrill stub, countersink depth versus finished board thickness, and press-fit hole tolerance on large tools—what the files show and what must be confirmed.
Why PCB CAM Must Verify PTH and NPTH Hole Definitions
PTH vs NPTH conflicts appear when the hole chart and Gerber through-hole pads do not match. This CAM review covers plated vs non plated through holes, pad-to-drill overlay, and what to confirm before hole plating.
How PCB CAM Balances Copper Thickness, Trace Spacing, and Impedance Requirements
CAM review when PCB copper thickness, copper weight, and finished copper thickness conflict with trace spacing or impedance: 3 oz vs 6.89 mil, two ounce calls, and 0.5 oz base vs 1.5 oz after hole copper.
How PCB CAM Resolves Conflicting Impedance Control Requirements
CAM review of PCB impedance control when the table and Gerber conflict—missing 90 ohm 5/5 mil traces, 4.16/7 mil swaps, or one width for 100 ohm differential and 50 ohm. What gets measured and what you confirm.
PCB CAM Review to Overcome Complex Stackup and Lamination Challenges
CAM review of PCB stackup and lamination when the drawing and press figure, core and prepreg, copper thickness, and inner-layer copper do not agree. Confirms which construction to press.
PCB CAM Review for Copper and SMD Pads Near the Board Edge
How CAM reviews PCB edge clearance on the outline overlay. When a copper pour or SMD pad sits on the outline or a V-cut, the close is accept edge copper exposure, confirm a copper shave, or confirm a pad trim.
Why Tooling Holes and Fiducial Marks Matter in PCB Panelization
If panelization is required but the board has no PCB tooling holes or fiducial marks, CAM checks process-edge additions and solder mask openings that leave copper exposed around the mark.
Common PCB V-Cut Issues Found During PCB CAM Review
AIVON CAM review of PCB V-cut: missing score location, V-cut angle and remaining thickness with no tolerance, stamp holes on the same tab, and pads that expose copper after scoring.
PCB Stamp Holes Spacing: How to Prevent Breakage and Excessive Burrs
CAM reviews PCB stamp holes spacing and mouse bite rows when the connecting tab is gone, the panel breaks early, or hole position leaves burrs. Confirm keep, delete one hole, or accept a relocated sketch.
PCB Edge Rails: What CAM Reviews in Panelization Before Production
Learn how CAM reviews PCB edge rails, tooling edges, rail geometry, corners, copper, and factory panel changes before production.
PCB UL Marking: What CAM Needs to Confirm Before Production
CAM review of PCB UL marking when the fabrication drawing and silkscreen layer disagree. Covers factory ID, UL logo, date code, laminate and solder mask recognition, and silk blocks without a QR note.
Why PCB Silkscreen Text Gets Clipped, Blurred, or Removed During CAM Review
PCB silkscreen design fails CAM when characters overlap, sit on pads, or print too small. Learn what silk-to-copper overlay shows and when to accept a clip, delete text, or send new artwork.
