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2 Layer FR4 PCB Production Record #FR4-20260423-049

FR4 PCB 2 Layers ENIG (Immersion Gold) 3/3mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 179 x 158.3 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Mar 23 21:40
Files Ready
Mar 23 21:40
Engineering Review Completed
Mar 23 22:42
Payment down
Apr 03 19:46
Production Started
Apr 14 19:16
Production Completed
Apr 23 19:11
Progress: 0/6
Engineering Review time: 1.1 h Multiple File Revisions
Production time: 9.0d With Engineering Questions

Logistics Information

Production Completed→Shipping : 2.1 h
Carrier
FedEx IP
Destination
NETHERLANDS, THE
Shipping Method
Express Air
Shipping Time
Apr 23 21:11

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Solder Mask Application
05
Electroless Nickel Deposition
06
Immersion Gold Deposition
07
Electrical Testing

Manufacturing Summary

This 2-layer FR-4 board (179 × 158.3 mm, 1.6 mm finished thickness) was produced in a quantity of 120 pieces (20 sets) on KB-6165F TG150 material with 1 oz copper on both sides. The design featured 0.3 mm minimum holes, 3 mil line width/space, ENIG surface finish, full solder mask over vias, and 3×2 panelization with 7 mm process edges on all four sides using V-CUT depanelization. Production was completed in 11 days with 100% flying probe testing and delivery of electrical test reports plus quality certificates.

 

DFM review focused on panelization and manufacturability. Component pads positioned too close to or over the board edge were adjusted per customer panel design recommendation to maintain 7 mm borders and prevent exposed copper. Tight 4 mil pad spacing was highlighted as insufficient for reliable solder mask bridges; customer confirmation was obtained on acceptable minimums. PTH holes without solder mask openings risked ink flow onto pads affecting component insertion, while mixed via windowing (some double-sided open) required clarification to avoid ink intrusion and edge redness. Silk screen frames, character placement near pads, and process edge details including fiducials, V-CUT lines, and copper balancing were all verified and optimized in the final production files.

 

All confirmed adjustments were implemented, resulting in boards that met dimensional tolerances, solder mask coverage, and electrical requirements with clean V-CUT edges. For detailed resolution of the tight pad spacing and edge clearance along with V-CUT panelization handling in this build, refer to the related engineering case.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-094 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail

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