ENIG Flexible PCB Production Record #FPC-20260516-007
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 5 pcs |
| Layers | 3 Layers | Board Type | Panel PCB |
| Dimensions | 76.2 x 457.2 mm | Copper Weight | 1/3OZ |
| Thickness | 0.15 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Yellow | Silkscreen | White |
| Material | Rolled Copper | Stiffener | FR4 Stiffener |
This manufacturing record covers the production of five 3-layer flexible PCB panels measuring 76.2 × 457.2 mm with an overall thickness of 0.15 mm. The build used 1/3 oz rolled copper on polyimide material to meet a 5/5 mil minimum track and spacing requirement, which required precise circuit imaging, etching, and polyimide material handling to maintain trace integrity across the long, narrow format. Yellow soldermask and white silkscreen were applied over the coverlay, while FR4 stiffeners were selectively bonded to deliver mechanical support in specific zones without compromising flexure.
Coverlay lamination preceded solder mask application, after which electroless nickel deposition and immersion gold deposition produced a uniform ENIG surface finish. Dynamic flex testing was performed to confirm circuit stability under repeated bending, followed by 100% electrical testing that verified continuity across all panels. These steps addressed the challenges inherent in thin, multilayer flexible circuits and ensured the finished boards retained both electrical performance and mechanical reliability.
The full sequence from engineering review through material preparation, testing, and inspection was completed in 7.1 days. Careful process controls during each stage prevented damage to the thin substrates and delivered panels that met all specified tolerances for this flexible PCB order.
This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→
ENIG finish on flexible PCBs delivers flat coplanarity and corrosion protection essential for fine-pitch assembly and long-term reliability in dynamic applications.
Plasma etching delivers gentle low temperature processing for flexible PCB etching on delicate substrates. It ensures precision anisotropy and cleanliness without warpage. Details include technical principles advantages best practices troubleshooting and standards for reliable flexible electronics production.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260707-032 | Flexible PCB | 4 | 157.2 x 38.6 | Yellow | ENIG (Immersion Gold) | 125 | View detail |
| FPC-20260526-023 | Flexible PCB | 4 | 50 x 75 | Black | ENIG (Immersion Gold) | 5 | View detail |
| FPC-20260509-056 | Flexible PCB | 4 | 86 x 46 | Yellow | ENIG (Immersion Gold) | 50 | View detail |
