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4 Layer Flexible PCB Production Record #FPC-20260707-032

Flexible PCB 4 Layers ENIG (Immersion Gold) PI Stiffener 3/3mil Small Volume
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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 125 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 157.2 x 38.6 mm Copper Weight 1/3OZ
Thickness 0.2 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Yellow Silkscreen White
Material Rolled Copper Stiffener PI Stiffener

Manufacturing Timeline

Order Created
Jun 10 17:57
Files Ready
Jun 10 17:57
Engineering Review Completed
Jun 11 11:03
Payment down
Jun 17 06:15
Production Started
Jun 17 06:16
Production Completed
Jul 03 14:04
Progress: 0/6
Engineering Review time: 0.7d
Production time: 16.4d With Engineering Questions

Logistics Information

Production Completed→Shipping : 3.9d
Carrier
DHL
Destination
NEW ZEALAND
Shipping Method
Express Air
Shipping Time
Jul 07 10:17

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Inner Layer Imaging
05
Circuit Imaging & Etching
06
Layer Stack Alignment
07
High Pressure Lamination
08
Coverlay Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Dynamic Flex Testing
13
Electrical Testing

Manufacturing Summary

This production record covers 125 units of 4-layer flexible PCBs built on 0.2 mm polyimide with 1/3 oz rolled copper. The boards measure 157.2 × 38.6 mm and incorporate 3/3 mil trace and spacing, a yellow solder mask, white silkscreen, PI stiffeners, and immersion gold ENIG finish. Minimum hole size of 0.3 mm was maintained across the thin construction, requiring precise material handling to preserve flexibility while meeting the tight geometry.

 

We performed inner layer imaging, circuit etching, high-pressure lamination, and coverlay application under controlled conditions to ensure layer registration and mechanical stability. Electroless nickel and immersion gold deposition followed solder mask processing, delivering uniform plating on the fine features. Dynamic flex testing was conducted to verify endurance, while 100 % electrical testing confirmed net continuity and isolation.

 

The entire run was completed in 16.4 days with consistent results across all boards, demonstrating repeatable execution for thin, high-density flexible circuits that require both precision etching and reliable mechanical performance.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260526-023 Flexible PCB 4 50 x 75 Black ENIG (Immersion Gold) 5 View detail
FPC-20260516-007 Flexible PCB 3 76.2 x 457.2 Yellow ENIG (Immersion Gold) 5 View detail
FPC-20260509-056 Flexible PCB 4 86 x 46 Yellow ENIG (Immersion Gold) 50 View detail

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