PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 1000 pcs |
| Layers | 4 Layers | Board Type | Single PCB |
| Dimensions | 357 x 45.8 mm | Copper Weight | 1/3OZ |
| Thickness | 0.23 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Black | Silkscreen | White |
| Material | Rolled Copper | Stiffener | Steel Sheet Stiffener |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order comprised 1000 units of 4-layer flexible circuit boards, each measuring 357 x 45.8 mm with a total thickness of 0.23 mm. Built with rolled copper on polyimide substrate and reinforced with steel sheet stiffeners, the boards demanded careful FPC material preparation and precise layer alignment during high pressure lamination. These steps ensured the multilayer structure remained intact while supporting the required bend characteristics.
Following circuit imaging and etching at 6/6 mil geometry, coverlay lamination was applied prior to black soldermask and white silkscreen printing. Immersion gold ENIG surface finish was deposited to provide reliable pad surfaces. Dynamic flex testing together with AOI inspection and electrical testing validated the mechanical and electrical performance of the complete batch.
Completed over a 19-day production cycle, the run delivered consistent outcomes tailored to the specific demands of these thin flexible circuits.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260821-065 | Flexible PCB | 4 | 111.25 x 16.75 | Yellow | ENIG (Immersion Gold) | 5 | View detail |
| FPC-20260819-026 | Flexible PCB | 4 | 59.8 x 65.5 | Yellow | ENIG (Immersion Gold) | 25 | View detail |
| FPC-20260803-025 | Flexible PCB | 2 | 292.5 x 8.5 | Yellow | ENIG (Immersion Gold) | 1000 | View detail |
