Coupons
Help
  • FAQ
    browse most common questions
  • Live Chat
    talk with our online service
  • Email
    contact your dedicated sales:
EN
EN

2 Layer Flexible PCB Production Record #FPC-20260803-025

Start Flexible PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 1000 pcs
Layers 2 Layers Board Type Single PCB
Dimensions 292.5 x 8.5 mm Copper Weight 1/3OZ
Thickness 0.1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Yellow Silkscreen White
Material Rolled Copper Stiffener PI Stiffener

Manufacturing Timeline

Order Created
Jul 23 14:48
Files Ready
Jul 23 14:48
Engineering Review Completed
Jul 23 15:25
Payment down
Jul 23 15:25
Production Started
Jul 23 15:25
Production Completed
Aug 03 09:30
Progress: 0/6
Engineering Review time: 0.6 h
Production time: 10.8d

Logistics Information

Production Completed→Shipping : 1h
Carrier
FedEx IP
Destination
PHILIPPINES, THE
Shipping Method
Express Air
Shipping Time
Aug 03 10:29

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Circuit Imaging & Etching
05
Coverlay Lamination
06
Solder Mask Application
07
Electroless Nickel Deposition
08
Immersion Gold Deposition
09
Dynamic Flex Testing
10
Panelization Optimization
11
Batch AOI Inspection
12
Yield Control Management
13
Electrical Testing

Manufacturing Summary

For the order of 1000 2-layer flexible circuit boards, production focused on the unique geometry of these long, narrow circuits measuring 292.5 x 8.5 mm at just 0.1 mm thick. Fabricated with rolled copper at 1/3 oz on polyimide, the boards incorporated yellow solder mask, white legend printing, PI stiffeners, and immersion gold ENIG finish. The 6/6 mil trace spacing and 0.3 mm holes represented conventional geometry for this thin flex construction.

 

Processes centered on precise polyimide material handling to avoid damage to the delicate substrate. After circuit imaging and etching came coverlay lamination, solder mask application, and the electroless nickel with immersion gold deposition. Dynamic flex testing was performed to validate bending reliability, supplemented by batch AOI and full electrical testing.

 

Completed within 10.8 days, the run produced uniformly reliable flexible circuits. The combination of thin profile, custom stiffener placement, and specialized color scheme was executed to match the customer's exact requirements for form and function.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260821-065 Flexible PCB 4 111.25 x 16.75 Yellow ENIG (Immersion Gold) 5 View detail
FPC-20260819-026 Flexible PCB 4 59.8 x 65.5 Yellow ENIG (Immersion Gold) 25 View detail
FPC-20260810-032 Flexible PCB 4 357 x 45.8 Black ENIG (Immersion Gold) 1000 View detail

2026 AIVON.COM All Rights Reserved
Intellectual Property Rights | Terms of Service | Privacy Policy | Refund Policy