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4 Layer Flexible PCB Production Record #FPC-20260526-023

Flexible PCB 4 Layers ENIG (Immersion Gold) Steel Sheet Stiffener Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 5 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 50 x 75 mm Copper Weight 1/2OZ
Thickness 0.25 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Black Silkscreen White
Material Rolled Copper Stiffener Steel Sheet Stiffener

Manufacturing Timeline

Order Created
May 04 23:30
Files Ready
May 04 23:30
Engineering Review Completed
May 05 00:40
Payment down
May 06 23:26
Production Started
May 06 23:31
Production Completed
May 26 11:29
Progress: 0/6
Engineering Review time: 0.7 h
Production time: 19.5d With Engineering Questions

Logistics Information

Production Completed→Shipping : 2 min
Carrier
DHL
Destination
CANADA
Shipping Method
Express Air
Shipping Time
May 26 11:30

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Inner Layer Imaging
05
Circuit Imaging & Etching
06
Layer Stack Alignment
07
High Pressure Lamination
08
Coverlay Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Dynamic Flex Testing
13
Electrical Testing

Manufacturing Summary

This small-quantity run consisted of five 4-layer flexible PCBs, each measuring 50 x 75 mm and built to a total thickness of just 0.25 mm using rolled copper of 1/2 oz per layer. The manufacturing process emphasized proper polyimide material handling, accurate circuit imaging and etching, followed by precise layer alignment and high pressure lamination. These steps were critical to achieving the required flexibility while preserving interlayer registration on such thin material.

 

Subsequent processes included coverlay lamination, black solder mask application with white legend, and selective attachment of steel sheet stiffeners for mechanical reinforcement. The immersion gold ENIG surface finish provided excellent solderability and long-term reliability on the exposed pads. We conducted dynamic flex testing to simulate real-world bending cycles, complemented by thorough electrical testing to verify all connections met the 6/6 mil design rules and 0.3 mm minimum hole diameter.

 

Completed over a 19.5-day production window, the boards exhibited consistent quality with no deviations in the flexible construction, ensuring dependable performance for the intended application.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260707-032 Flexible PCB 4 157.2 x 38.6 Yellow ENIG (Immersion Gold) 125 View detail
FPC-20260516-007 Flexible PCB 3 76.2 x 457.2 Yellow ENIG (Immersion Gold) 5 View detail
FPC-20260509-056 Flexible PCB 4 86 x 46 Yellow ENIG (Immersion Gold) 50 View detail

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