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4 Layer Flexible PCB Production Record #FPC-20260509-056

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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 50 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 86 x 46 mm Copper Weight 1/2OZ
Thickness 0.2 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Yellow Silkscreen White
Material Rolled Copper Stiffener PI Stiffener

Manufacturing Timeline

Order Created
Apr 20 21:35
Files Ready
Apr 20 21:35
Engineering Review Completed
Apr 20 22:21
Payment down
Apr 21 23:16
Production Started
Apr 21 23:17
Production Completed
May 09 17:13
Progress: 0/6
Engineering Review time: 0.2 h
Production time: 17.8d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.8 h
Carrier
DHL
Destination
UNITED KINGDOM
Shipping Method
Express Air
Shipping Time
May 09 17:59

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Inner Layer Imaging
05
Circuit Imaging & Etching
06
Layer Stack Alignment
07
High Pressure Lamination
08
Coverlay Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Dynamic Flex Testing
13
Electrical Testing

Manufacturing Summary

This 4-layer flexible PCB measured 86 × 46 mm with a finished thickness of 0.2 mm and used rolled copper at ⅓ oz / ½ oz weights. Produced as 50 single pieces, the order featured ENIG surface finish (1.00 µm gold), yellow coverlay on both sides, and white silkscreen. A single 0.1 mm PI stiffener was specified, minimum holes were 0.3 mm with 6 mil line/space, and laser forming completed the outline. The 15-day schedule included full flying-probe testing.

 

DFM review resolved outline, clearance, and stiffener details. GM and GM1 outline layers differed in size; production followed the GM1 outline after confirmation. Traces on both sides ran flush to the board edge; with laser tolerance of 0.1 mm this would expose gold and create short risk, so traces were trimmed inward to maintain 0.15 mm clearance. The single stiffener was interpreted as PI reinforcement only at the connector finger area, with other GM15 regions ignored. The distance of the PI stiffener from FPC gold finger opening was too close and risked breakage during insertion; the stiffener was enlarged to provide 0.5 mm clearance. Two vias that extended onto the circuit layer were also clarified.

 

Confirmed outline reference, trace setback, and stiffener geometry were implemented prior to production. The thin flex boards achieved consistent ENIG plating and reliable stiffener adhesion within the planned timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the revised mechanical and electrical requirements.

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Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260707-032 Flexible PCB 4 157.2 x 38.6 Yellow ENIG (Immersion Gold) 125 View detail
FPC-20260526-023 Flexible PCB 4 50 x 75 Black ENIG (Immersion Gold) 5 View detail
FPC-20260516-042 Flexible PCB 3 76.2 x 457.2 Yellow ENIG (Immersion Gold) 5 View detail

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