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4 Layer Flexible PCB Production Record #FPC-20260509-056

Flexible PCB 4 Layers ENIG (Immersion Gold) PI Stiffener Small Volume
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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 50 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 86 x 46 mm Copper Weight 1/2OZ
Thickness 0.2 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Yellow Silkscreen White
Material Rolled Copper Stiffener PI Stiffener

Manufacturing Timeline

Order Created
Apr 20 21:35
Files Ready
Apr 20 21:35
Engineering Review Completed
Apr 20 22:21
Payment down
Apr 21 23:16
Production Started
Apr 21 23:17
Production Completed
May 09 17:13
Progress: 0/6
Engineering Review time: 0.2 h
Production time: 17.8d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.8 h
Carrier
DHL
Destination
UNITED KINGDOM
Shipping Method
Express Air
Shipping Time
May 09 17:59

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Inner Layer Imaging
05
Circuit Imaging & Etching
06
Layer Stack Alignment
07
High Pressure Lamination
08
Coverlay Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Dynamic Flex Testing
13
Electrical Testing

Manufacturing Summary

This order consisted of 50 pieces of 4-layer flexible PCBs built on polyimide with rolled copper foil. Measuring 86 × 46 mm and only 0.2 mm thick, the boards featured 0.5 oz copper layers, yellow soldermask, white silkscreen, PI stiffeners, and an immersion gold ENIG surface finish. With a minimum track spacing of 6/6 mil and hole size of 0.3 mm, the design called for precise material preparation and layer alignment during high-pressure lamination to achieve reliable multilayer registration on this thin flexible substrate.

 

Production followed a sequence of polyimide material handling, inner layer imaging, circuit etching, and coverlay lamination before solder mask application. Electroless nickel and immersion gold deposition provided a flat, solderable surface while PI stiffeners were selectively bonded to reinforce connector areas without restricting flex performance.

 

Dynamic flex testing and full electrical testing confirmed endurance and netlist integrity across the full batch. The run was completed in 17.8 days, delivering consistent boards that met the mechanical and electrical requirements of this flexible circuit application.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260707-032 Flexible PCB 4 157.2 x 38.6 Yellow ENIG (Immersion Gold) 125 View detail
FPC-20260526-023 Flexible PCB 4 50 x 75 Black ENIG (Immersion Gold) 5 View detail
FPC-20260516-007 Flexible PCB 3 76.2 x 457.2 Yellow ENIG (Immersion Gold) 5 View detail

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