PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 10 pcs |
| Layers | 2 Layers | Board Type | Single PCB |
| Dimensions | 190 x 37.74 mm | Copper Weight | 1oz |
| Thickness | 0.4 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.25mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record details the manufacturing of 10 thin 2-layer FR4 PCBs, each measuring 190 x 37.74 mm with an overall thickness of 0.4 mm. The specification called for 1 oz copper weight, a standard 6/6 mil minimum track and spacing, and 0.25 mm holes. Immersion gold ENIG surface finish was applied to deliver reliable pad quality and long-term protection.
We conducted engineering review and prepared materials specifically for the narrow, thin boards to minimize any risk of distortion. Circuit imaging and etching established the conductive patterns, after which green solder mask and white silkscreen were precisely aligned and cured. The process continued with electroless nickel deposition and immersion gold deposition to form the final surface.
Electrical testing validated every board in the set. Completed over 3.1 days, this run achieved uniform results with the required consistency for these lightweight, elongated PCB designs.
Explore More PCB Manufacturing Resources
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |
