| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 25 pcs |
| Layers | 2 Layers | Board Type | Panel PCB |
| Dimensions | 215 x 154 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Matte Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
This production batch included 4-layer impedance controlled PCBs built on standard FR4 material with an overall thickness of 1.6 mm. The specifications featured a minimum track and spacing of 5/5 mil, which classified the geometry as requiring tighter process controls during circuit imaging and etching. Engineering review confirmed the manufacturability of the stackup, with particular attention paid to the dielectric thicknesses needed for the target impedance values of the design.
We applied solder mask after the pattern plating stage, then proceeded with electroless nickel deposition followed by immersion gold deposition to produce a high-quality ENIG surface finish. This immersion gold ENIG coating ensures reliable soldering properties and flat pad surfaces suitable for fine-pitch assembly, avoiding the uneven topography sometimes associated with alternative finishes.
Final electrical testing verified impedance control within tolerance across all delivered panels. Completed in 2.7 days, the order moved steadily through each manufacturing stage, resulting in full compliance with every specified requirement and consistent board quality from first to last panel.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |