PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 400 pcs |
| Layers | 2 Layers | Board Type | Panel PCB |
| Dimensions | 77 x 154.5 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Blue | Silkscreen | None |
| Stack-up | Custom | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This batch included 400 pieces of 2-layer FR4 panel PCBs sized at 77 x 154.5 mm with 1.6 mm thickness and 1 oz copper. Specified with 6/6 mil minimum track and spacing, holes no smaller than 0.3 mm, and a custom stackup, the boards received blue soldermask and an immersion gold ENIG finish without any silkscreen. These parameters required careful attention during imaging to maintain uniformity across the panels.
We conducted an engineering review followed by material preparation and circuit imaging with etching to form the traces. Solder mask application preceded the electroless nickel and immersion gold deposition stages. Subsequent batch AOI inspection and electrical testing verified the integrity of all 400 panels produced.
Completed within 7.5 days, this order was executed with focus on consistent ENIG plating quality and reliable electrical performance. The resulting panels demonstrate dependable manufacturing suitable for standard 2-layer applications at this volume.
Explore More PCB Manufacturing Resources
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |
