| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 30 pcs |
| Layers | 2 Layers | Board Type | Panel PCB |
| Dimensions | 240 x 263 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 10/10mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.6mm |
| Solder Mask | Green | Silkscreen | None |
| Stack-up | Custom | Impedance Control | No |
This production run delivered 30 units of 2-layer FR4 panel PCBs, each measuring 240 × 263 mm with 1.6 mm thickness and 1 oz copper. The boards used a conventional 10/10 mil track and spacing, 0.6 mm minimum holes, green solder mask, and no silkscreen legend. A custom stackup was followed exactly, and immersion gold ENIG was specified to provide uniform pad protection and long-term solderability on the large panel format.
Manufacturing began with engineering review of the panel layout and material preparation, followed by precise circuit imaging and etching. Solder mask application was aligned to the large panels before electroless nickel deposition and immersion gold deposition created the ENIG finish. Every panel underwent full electrical testing to verify continuity and isolation across all 30 units.
The complete order was executed in 2.4 days, yielding consistent surface quality and dimensional stability suited for downstream assembly. This run illustrates reliable handling of sizable panelized 2-layer boards with ENIG finish when silkscreen is intentionally omitted.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |