| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 75 pcs |
| Layers | 2 Layers | Board Type | Panel PCB |
| Dimensions | 210 x 148 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
This order comprised 75 panels of 2-layer FR4 PCB, each sized 210 × 148 mm with 1.6 mm thickness, 1 oz copper, and a custom stackup. With a conventional 6/6 mil trace and spacing geometry together with 0.3 mm minimum holes, the design allowed standard processing parameters while still requiring careful registration during circuit imaging and etching. Material preparation and engineering review confirmed all parameters before production began, setting a stable foundation for the subsequent steps.
Green soldermask and white silkscreen were applied uniformly across the panels. The immersion gold ENIG surface finish was formed through electroless nickel deposition followed by precise gold immersion, delivering a flat, oxidation-resistant pad surface well suited for reliable assembly. Every panel then completed full electrical testing to verify continuity and isolation, confirming consistent performance across the entire run.
The complete sequence from initial review to final test took 8.2 days and produced boards that met all dimensional and plating requirements without deviation, supporting the customer’s scheduled assembly needs.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |