PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 5 pcs |
| Layers | 6 Layers | Board Type | Single PCB |
| Dimensions | 130 x 240 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | HASL Lead Free | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order consisted of standard 4-layer FR4 PCBs produced in panels with 1.6 mm finished thickness and 1 oz copper weight on all layers. The design used conventional 6/6 mil trace and spacing, allowing stable imaging and etching of the inner layers without requiring special controls. We completed material preparation, circuit imaging, etching, and layer stack alignment prior to high pressure lamination, maintaining registration within standard tolerances throughout the run.
Solder mask was applied evenly before the molten solder coating and hot air leveling steps, resulting in a uniform HASL Lead Free surface finish that supports both through-hole and SMT assembly. The chosen parameters kept the process flow straightforward while ensuring consistent coating thickness and solderability across every panel.
Electrical testing verified continuity and isolation on all nets, with the full production cycle completed in 5.5 days. The batch left the line with repeatable dimensional stability and reliable layer bonding, ready for immediate delivery to the customer.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260418-083 | FR4 PCB | 6 | 25 x 50 | Green | ENIG (Immersion Gold) | 15 | View detail |
| FR4-20260407-029 | FR4 PCB | 4 | 150 x 120 | Green | HASL Lead Free | 10 | View detail |
| FR4-20260318-006 | FR4 PCB | 6 | 330 x 80 | Green | HASL Lead Free | 25 | View detail |
