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4 Layer FR4 PCB Production Record #FR4-20260407-029

FR4 PCB 4 Layers HASL Lead Free Impedance Control Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 10 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 150 x 120 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 5/5mil
Surface Finish HASL Lead Free Min Hole Size 0.25mm
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control Yes

Manufacturing Timeline

Order Created
Feb 04 16:44
Files Ready
Feb 04 16:44
Engineering Review Completed
Feb 04 18:12
Payment down
Feb 27 09:32
Production Started
Feb 27 09:32
Production Completed
Apr 07 17:34
Progress: 0/6
Engineering Review time: 1.5h Multiple File Revisions
Production time: 39.4d With Engineering Questions, plus assembly time

Logistics Information

Production Completed→Shipping : 0.5 h
Carrier
FedEx IP
Destination
SAUDI ARABIA
Shipping Method
Express Air
Shipping Time
Apr 07 17:59

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Molten Solder Coating
11
Hot Air Leveling
12
TDR Impedance Testing
13
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 PCB (H4P-2776-AI18521A) was produced in a 10-piece run using TG130 material at 1.6mm finished thickness with 1oz copper on all layers. Measuring 150 × 120 mm, the board featured 0.25mm minimum vias, impedance control requirements, green solder mask, white silkscreen, and lead-free HASL surface finish. The design was processed as single-unit panels with standard process edges including fiducials and tooling holes.

 

During CAM review, several manufacturability issues required clarification, including insufficient copper clearance to V-CUT lines, tight 0.25mm via spacing that risked drill breakage, duplicate inner layer files (GP1 and G1), and pad size modifications for MBRS240LT3G diodes. These were addressed by adjusting copper features near scoring lines to prevent edge exposure, optimizing via placement for reliable drilling and plating, confirming the correct inner layer data, and verifying the revised diode footprints against annular ring and solderability requirements. Board thickness was standardized to 1.6mm ±10% for process consistency.

 

All engineering questions were resolved through production file revisions and customer confirmation, allowing the order to proceed without deviation from the required 11-day delivery. The finalized data package ensured stable fabrication and electrical testing results. For detailed analysis of the V-CUT clearance and via spacing resolution, refer to the full engineering case study.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail
FR4-20260422-074 FR4 PCB 4 210 x 100 Green OSP 10 View detail
FR4-20260318-006 FR4 PCB 6 330 x 80 Green HASL Lead Free 25 View detail

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