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2 Layer FR4 PCB Production Record #FR4-20260126-052

FR4 PCB 2 Layers ENIG (Immersion Gold) Small Volume
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 200 pcs
Layers 2 Layers Board Type Single PCB
Dimensions 87 x 87 mm Copper Weight 2oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask White Silkscreen Black
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Dec 22 22:28
Files Ready
Dec 22 22:28
Engineering Review Completed
Dec 23 00:51
Payment down
Jan 06 15:35
Production Started
Jan 06 15:39
Production Completed
Jan 17 18:27
Progress: 0/6
Engineering Review time: 0.8 h
Production time: 11.2d With Engineering Questions

Logistics Information

Production Completed→Shipping : 9.0d
Carrier
FedEx IP
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Jan 26 18:09

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Thick Copper Electroplating
05
Controlled Copper Etching
06
Solder Mask Application
07
Electroless Nickel Deposition
08
Immersion Gold Deposition
09
Electrical Testing

Manufacturing Summary

This 2-layer FR-4 board measured 87 × 87 mm with 1 oz inner and 2 oz outer copper and a 1.6 mm finished thickness using KB-6167F TG170 material. Produced in a high-volume run of 200 pieces as single boards, the design featured standard 6 mil line/space, ENIG surface finish, and a high hole density of 236000 per square meter. No impedance control or blind vias were required, with mechanical forming and 100% flying probe testing. UL marking was requested without the provided logo file.

 

DFM review identified copper thickness conflicts. The specified 3 oz outer copper could not be achieved due to 6.89 mil minimum spacing falling below the 8 mil threshold for reliable 3 oz processing. For 2 oz copper, BGA and IC pad areas with 7.87 mil spacing prevented solder mask bridges. These features were processed as solder mask defined pads to guarantee bridge integrity, accepting partial ink coverage around pads while keeping final pad dimensions unchanged. Multiple confirmations resolved the approach for both BGA and trace areas. 

 

Production completed within 11 days with all electrical and dimensional parameters met. The higher outer copper weight and dense via pattern were consistently achieved, delivering boards with good thermal and mechanical properties for this volume order.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260528-028 FR4 PCB 2 185 x 245 Green HASL Lead Free 5 View detail
FR4-20260526-001 FR4 PCB 2 100 x 100 Green HASL Lead Free 10 View detail
FR4-20260525-001 FR4 PCB 2 50 x 45 Matte Green HASL Lead Free 20 View detail

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