4 Layer FR4 PCB Production Record #FR4-20260420-121
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 5 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 65.02 x 287.27 mm | Copper Weight | 1oz |
| Thickness | 0.8 mm | Min Track / Spacing | 10/10mil |
| Surface Finish | HASL with Lead | Min Hole Size | 0.3mm↑ |
| Solder Mask | White | Silkscreen | Yellow |
| Stack-up | Default | Impedance Control | No |
This 4-layer FR-4 PCB was produced in a quantity of 5 pieces with overall dimensions of 65.02 × 287.27 mm and a finished thickness of 0.8 mm using 1 oz copper on both inner and outer layers. The long, narrow board utilized standard 10 mil line width and spacing, lead-free HASL surface finish, cold white solder mask, and yellow silkscreen. Mechanical routing and V-scoring were applied for panel separation in a 1×1 configuration, with full flying probe testing ensuring electrical integrity within a tight 3-day lead time.
Several DFM challenges required resolution prior to production. Hole file discrepancies between provided layers and actual Gerber data were clarified, along with text orientation confirmation on inner layers L3 and L4. The primary engineering focus involved customer-requested countersink holes: their positions, parameters, and proximity to board edges posed risks of edge breakout during routing. Depth calculations further indicated that the specified countersink depth of approximately 0.85 mm on a 0.8 mm board could damage inner layer copper, prompting detailed verification and adjustments to maintain structural integrity and avoid plating or delamination issues.
All adjustments were implemented after confirmation, including optimized countersink execution and edge margin controls. Production completed with consistent solder mask registration and flatness across the thin multilayer stackup. Detailed records of the countersink depth control on thin multilayer boards used for this order provide further reference on similar risk mitigation approaches.
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260507-001 | FR4 PCB | 2 | 414 x 405.7 | White | HASL Lead Free | 30 | View detail |
| FR4-20260505-078 | FR4 PCB | 4 | 119 x 210 | Green | OSP | 100 | View detail |
| FR4-20260430-043 | FR4 PCB | 6 | 171.2 x 305 | Green | HASL Lead Free | 5 | View detail |
