6 Layer FR4 PCB Production Record #FR4-20260429-022
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 25 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 80 x 200 mm | Copper Weight | 1oz |
| Thickness | 2 mm | Min Track / Spacing | 3/3mil |
| Surface Finish | HASL Lead Free | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
This 6-layer FR-4 TG150 board measured 80 × 200 mm with 2.0 mm finished thickness and 1 oz copper on both inner and outer layers. Produced in a 25-piece run, the job used 0.2 mm minimum holes, 3 mil trace/space geometry, green solder mask, white legend, and lead-free HASL surface finish. Panelization was single-up with 4 mm process edges on top and bottom. Standard 100% flying probe testing was performed with no impedance or back-drill requirements.
CAM engineering identified several DFM conflicts during file review. Multiple vias overlapped or sat too close to larger holes and required deletion to maintain mechanical integrity. Several non-plated holes had insufficient annular rings that could not be reliably processed, leading to removal of the associated pads. Solder mask and legend interactions on openings were adjusted by clearing characters and frames to avoid pad encroachment. The primary challenge involved via openings on a HASL board: files showed inconsistent windowing while the customer requested via tenting. After review, non-opened vias were processed with ink plugging to minimize tin bead entrapment and surface discoloration, while accepting limited solder in open vias per final customer confirmation.
These 6-layer FR-4 TG150 DFM adjustments followed established CAM resolution paths and ensured clean fabrication without impacting electrical performance. The order completed on schedule with full test yield and passed quality inspection, delivering consistent boards ready for assembly.
Six layer FR4 boards provide optimized routing density and power distribution. They require precise lamination and plating process control to maintain yield and reliability.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260507-001 | FR4 PCB | 2 | 414 x 405.7 | White | HASL Lead Free | 30 | View detail |
| FR4-20260430-043 | FR4 PCB | 6 | 171.2 x 305 | Green | HASL Lead Free | 5 | View detail |
