PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 200 pcs |
| Layers | 18 Layers | Board Type | Panel PCB |
| Dimensions | 22 x 14 mm | Copper Weight | 1oz |
| Thickness | 2.2 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.25mm |
| Solder Mask | Green | Silkscreen | None |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record covers 200 panels of 18-layer HDI PCBs with blind vias and a custom stackup. The boards measure 22 x 14 and were built to a 2.2 mm thickness using 1 oz copper, with minimum 5/5 mil track and spacing. During inner layer imaging, circuit etching, and high-pressure lamination, strict registration tolerances were maintained to ensure via reliability in this complex multilayer construction.
Green soldermask was applied before electroless nickel and immersion gold deposition to produce a uniform ENIG surface finish. No silkscreen was required. Comprehensive electrical testing followed to verify all interconnects and insulation properties across the panels.
The 30.2-day production cycle accommodated the detailed steps necessary for these thicker, high-layer-count immersion gold ENIG boards. Every panel in the run met the dimensional and electrical criteria, supporting consistent performance in the intended application.
Explore More PCB Manufacturing Resources
ENIG HDI PCB Manufacturing Insights
ENIG finished HDI PCBs require precise control of sequential lamination, laser drilling, copper plating, and electroless nickel immersion gold deposition to ensure via reliability and solderable surfaces.
Common Engineering Issues in HDI PCB Manufacturing with Different Surface Finishes
This article provides senior engineering insights into HDI PCB manufacturing with different surface finishes such as ENIG and OSP. It covers common engineering queries including via-in-pad design, solder mask registration, microvia reliability, and surface finish compatibility, along with practical DFM solutions to improve fabrication yield.
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260512-016 | HDI PCB | 4 | 63.5 x 127 | Green | ENIG (Immersion Gold) | 10 | View detail |
| HDI-20260418-016 | HDI PCB | 4 | 162 x 73 | Red | ENIG (Immersion Gold) | 20 | View detail |
| HDI-20260418-085 | HDI PCB | 6 | 32 x 46 | Green | ENIG (Immersion Gold) | 15 | View detail |
