PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 20 pcs |
| Layers | 4 Layers | Board Type | Single PCB |
| Dimensions | 162 x 73 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.15mm |
| Solder Mask | Red | Silkscreen | White |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order comprised 20 pieces of 4-layer HDI PCBs, each measuring 162 × 73 mm with 1.6 mm thickness and 1 oz copper. The design specified 4/4 mil minimum track and spacing, 0.15 mm holes, blind vias, and a custom stackup. Manufacturing began with engineering review and precise inner layer imaging to maintain registration on the tighter geometry, followed by circuit etching, careful layer alignment, and high-pressure lamination to secure the blind via connections.
Red soldermask and white silkscreen were applied prior to surface finishing. The electroless nickel and immersion gold deposition created a uniform ENIG finish that supports reliable soldering without requiring impedance control. Every board then completed full electrical testing to confirm net continuity and isolation across all layers.
The complete sequence, from material preparation through final test, took 15.9 days and delivered consistent boards that met all dimensional and plating requirements for this small-volume run.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260530-027 | HDI PCB | 18 | 22 x 14 | Green | ENIG (Immersion Gold) | 200 | View detail |
| HDI-20260514-035 | HDI PCB | 4 | 210 x 100 | Green | OSP | 10 | View detail |
| HDI-20260512-016 | HDI PCB | 4 | 63.5 x 127 | Green | ENIG (Immersion Gold) | 10 | View detail |
