PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 125 pcs |
| Layers | 8 Layers | Board Type | Panel PCB |
| Dimensions | 188 x 100 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.15mm |
| Solder Mask | Matte Black | Silkscreen | White |
| HDI Structure | 3 | Blind/Buried Vias | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This 8-layer HDI circuit board order consisted of 125 panels, each 188 by 100 mm with 1.6 mm thickness and 1 oz copper weight. The 3-step HDI configuration with blind vias required sequential lamination and laser microvia drilling to realize the 0.15 mm minimum hole size alongside 5/5 mil track and spacing. These tighter geometries called for specialized handling in the circuit imaging and etching phases to ensure trace integrity.
We prepared the custom stackup materials and executed high-pressure lamination with strict attention to registration. Following via filling and plating, matte black soldermask was applied with white silkscreen legend. The boards then received immersion gold ENIG surface finish through electroless nickel deposition and gold immersion, providing a flat, reliable contact surface.
Electrical testing verified continuity and isolation across the full production run, confirming the build met all specified parameters for this HDI design. The completed panels reflect consistent manufacturing execution suitable for high-density applications.
Explore More PCB Manufacturing Resources
8 Layer HDI PCB Manufacturing Insights
Discover how AIVON manufactures 8 Layer HDI PCBs, including high-density interconnect structures, complex stackup management, microvia reliability, manufacturing challenges, and real production experience from customer orders.
Multilayer HDI PCB Common Engineering Queries in Manufacturing
Multilayer HDI PCBs frequently trigger CAM EQs on microvia spacing, via-in-pad plugging, stack-up, and impedance. Learn real root causes and design rules that raise first-pass yield.
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260718-0002 | HDI PCB | 4 | 37 x 26.6 | Green | ENIG (Immersion Gold) | 20 | View detail |
| HDI-20260717-0002 | HDI PCB | 8 | 137.8 x 100.5 | Matte Black | ENIG (Immersion Gold) | 200 | View detail |
| HDI-20260715-0002 | HDI PCB | 8 | 152.5 x 114 | Blue | ENIG (Immersion Gold) | 840 | View detail |