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8 Layer HDI PCB Production Record #HDI-20260720-0001

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PCB Specifications

Parameter Value Parameter Value
PCB Type HDI PCB Quantity 125 pcs
Layers 8 Layers Board Type Panel PCB
Dimensions 188 x 100 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.15mm
Solder Mask Matte Black Silkscreen White
HDI Structure 3 Blind/Buried Vias Yes

Manufacturing Timeline

Order Created
May 14 14:10
Files Ready
May 14 14:10
Engineering Review Completed
May 16 14:13
Payment down
May 16 14:13
Production Started
May 16 14:13
Production Completed
Jun 13 14:20
Progress: 0/6
Engineering Review time: 2.1d Multiple File Revisions
Production time: 28.1d

Logistics Information

Production Completed→Shipping : 2.8d
Carrier
FedEx IP
Destination
HONG KONG,CHINA
Shipping Method
Express Air
Shipping Time
Jun 16 08:00

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Sequential Lamination
08
Laser Microvia Drilling
09
Via Filling & Plating
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Electrical Testing

Manufacturing Summary

This 8-layer HDI circuit board order consisted of 125 panels, each 188 by 100 mm with 1.6 mm thickness and 1 oz copper weight. The 3-step HDI configuration with blind vias required sequential lamination and laser microvia drilling to realize the 0.15 mm minimum hole size alongside 5/5 mil track and spacing. These tighter geometries called for specialized handling in the circuit imaging and etching phases to ensure trace integrity.

 

We prepared the custom stackup materials and executed high-pressure lamination with strict attention to registration. Following via filling and plating, matte black soldermask was applied with white silkscreen legend. The boards then received immersion gold ENIG surface finish through electroless nickel deposition and gold immersion, providing a flat, reliable contact surface.

 

Electrical testing verified continuity and isolation across the full production run, confirming the build met all specified parameters for this HDI design. The completed panels reflect consistent manufacturing execution suitable for high-density applications.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
HDI-20260718-0002 HDI PCB 4 37 x 26.6 Green ENIG (Immersion Gold) 20 View detail
HDI-20260717-0002 HDI PCB 8 137.8 x 100.5 Matte Black ENIG (Immersion Gold) 200 View detail
HDI-20260715-0002 HDI PCB 8 152.5 x 114 Blue ENIG (Immersion Gold) 840 View detail

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