PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 840 pcs |
| Layers | 8 Layers | Board Type | Panel PCB |
| Dimensions | 152.5 x 114 mm | Copper Weight | 2oz |
| Thickness | 1.8 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Blue | Silkscreen | White |
| HDI Structure | 3 | Blind/Buried Vias | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order involved the manufacture of 840 panels of 8-layer HDI PCB, each sized 152.5 x 114 mm with a board thickness of 1.8 mm and 2oz copper. The build employed a custom stackup incorporating blind vias in a 3-step HDI configuration. With minimum trace width and spacing at 6 mil and hole sizes down to 0.2 mm, the boards received blue soldermask, white silkscreen, and an immersion gold ENIG surface finish.
Execution required sequential lamination processes, precision laser drilling for the microvias, followed by via filling, plating, and controlled etching to accommodate the thicker copper. These steps demanded careful management to achieve reliable interlayer connections without compromising the finer geometries.
Over the course of 62 days, the production maintained strict process controls. Comprehensive batch AOI inspection and electrical testing at completion confirmed high consistency across the entire quantity, delivering panels that met all specified parameters for the customer's project.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260720-0001 | HDI PCB | 8 | 188 x 100 | Matte Black | ENIG (Immersion Gold) | 125 | View detail |
| HDI-20260718-0002 | HDI PCB | 4 | 37 x 26.6 | Green | ENIG (Immersion Gold) | 20 | View detail |
| HDI-20260717-0002 | HDI PCB | 8 | 137.8 x 100.5 | Matte Black | ENIG (Immersion Gold) | 200 | View detail |
