8 Layer HDI PCB Production Record #HDI-20260717-0002

This order comprised 200 panels of 8-layer HDI PCBs built with a 3-step structure incorporating blind vias and a custom stackup. Measuring 137.8 × 100.5 mm at 1.6 mm thickness with 2 oz copper on all layers, the panels required sequential lamination and laser microvia drilling followed by via filling to create reliable interconnects. The 6/6 mil minimum trace and spacing represented standard geometry, while the absence of impedance control allowed standard etching parameters to deliver uniform conductor profiles.

Material preparation and inner layer imaging preceded high-pressure lamination cycles. Thick copper electroplating, controlled etching, and solder mask application produced the specified matte black finish with white silkscreen. Immersion gold ENIG surface treatment was completed through electroless nickel deposition, providing consistent pad quality across the panel array. These steps addressed the demands of the HDI configuration and 0.2 mm minimum hole size while maintaining registration throughout the multilayer build.

Final electrical testing confirmed continuity and isolation on all 200 panels after 38.4 days of production. The extended schedule accommodated the multiple lamination and plating sequences, resulting in stable, repeatable boards that met every defined specification.