PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 100 pcs |
| Layers | 8 Layers | Board Type | Panel PCB |
| Dimensions | 97 x 93.4 mm | Copper Weight | 3oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.25mm |
| Solder Mask | Black | Silkscreen | White |
| HDI Structure | 3 | Blind/Buried Vias | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
For this order, we produced 100 panels of 8-layer HDI PCBs that incorporate blind vias using a 3-step HDI structure. The dimensions are 97 x 93.4 mm with 1.6 mm thickness and 3 oz copper weight. Given the tighter 5/5 mil track spacing and 0.25 mm min hole size, the manufacturing sequence included inner layer imaging, sequential lamination, laser microvia drilling, via filling and plating, as well as thick copper electroplating and controlled copper etching.
The custom stackup was prepared with careful layer alignment before high pressure lamination. We then applied black soldermask and white silkscreen, followed by immersion gold ENIG surface finish through electroless nickel deposition and gold immersion.
These steps addressed the specific demands of combining heavier copper layers with fine HDI geometries. Comprehensive electrical testing verified the quality and consistency across all panels, confirming successful execution of this HDI PCB order.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260720-0001 | HDI PCB | 8 | 188 x 100 | Matte Black | ENIG (Immersion Gold) | 125 | View detail |
| HDI-20260718-0002 | HDI PCB | 4 | 37 x 26.6 | Green | ENIG (Immersion Gold) | 20 | View detail |
| HDI-20260717-0002 | HDI PCB | 8 | 137.8 x 100.5 | Matte Black | ENIG (Immersion Gold) | 200 | View detail |