7,500 m²
Class 10K Cleanroom
From component sourcing and SMT assembly to testing and final inspection. discover how AIVON turns your PCB designs into reliable assembled boards.
Class 10K Cleanroom
Production Lines
SMT Mounting Points/Day
Scalable PCBA Capacity from SMT to Final Testing
From SMT placement and THT soldering to assembly and testing, our PCBA facilities are equipped to support every stage of the manufacturing process. With 7 Siemens SMT lines, 3 DIP lines, and 3 assembly & testing lines, we deliver consistent production across different order volumes.
Our facilities can handle up to 10 million SMT mounting points and 180,000 THT soldering points per day, providing the capacity to move efficiently from production to final testing.
The PCBA manufacturing process begins with preparing the bare PCB, components, and production data. The engineering team reviews the PCB design, BOM, and component information to make sure the materials and assembly data are ready for production. Components are also checked against the BOM before they are released to the SMT line.
At this stage, the PCB and components need to be properly stored and handled to prevent issues such as moisture, contamination, or component mix-ups during assembly.
The PCBA manufacturing process begins with preparing the bare PCB, components, and production data.
GKG-G5 Automatic Stencil Printer
JT Solder Paste Inspection System
| Category | Capability |
|---|---|
| Type | SMT and THT |
| MOQ | No MOQ required for customers with R&D purposes |
| Component Size | 01005 chip size |
| Component Package | We accept tape and reel, tube, and tray packages for components |
| Maximum Mount Accuracy of Components (100FP) | ±50μm |
| Solderable PCB Type | Rigid PCB, FPC, Rigid-Flex PCB, Aluminum PCB |
| Size | Min: 50mm x 50mm, Max: 1200mm x 350mm |
| Board Thickness | 0.5mm-5mm |
Real PCBA Case Studies
Our engineering team reviews your PCB data, BOM, and assembly requirements before production to identify potential manufacturing issues early.
Each PCBA goes through a structured manufacturing process, with inspection and process controls at key stages from solder paste printing to final testing.
SPI and AOI inspections help detect solder paste and assembly defects during production, allowing issues to be identified and corrected before final delivery.
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