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4 Layer HDI PCB Production Record #HDI-20260514-035

HDI PCB 4 Layers OSP 4/4mil 0.1mm vias Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type HDI PCB Quantity 10 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 210 x 100 mm Copper Weight 1oz
Thickness 1 mm Min Track / Spacing 4/4mil
Surface Finish OSP Min Hole Size 0.1mm
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
May 01 23:01
Files Ready
May 01 23:03
Engineering Review Completed
May 01 23:47
Payment down
May 06 16:20
Production Started
May 06 16:20
Production Completed
May 14 09:26
Progress: 0/6
Engineering Review time: 0.8 h
Production time: 7.8d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.4 h
Carrier
DHL
Destination
SPAIN
Shipping Method
Express Air
Shipping Time
May 14 09:48

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Organic Coating Application
09
Anti-Oxidation Treatment
10
Electrical Testing

Manufacturing Summary

This order consisted of 10 panels of a 4-layer HDI PCB, each measuring 210 x 100 mm with 1.0 mm thickness and 1 oz copper weight. Featuring 4/4 mil trace and spacing, 0.1 mm minimum hole size, blind vias, and a custom stackup, the boards required precise process control during fabrication. OSP surface finish was selected, paired with green soldermask and white silkscreen lettering.

Manufacturing commenced with engineering review and material preparation, followed by inner layer imaging, circuit etching, and careful layer stack alignment prior to high pressure lamination. The blind vias demanded accurate drilling and plating sequences. Solder mask application, organic coating for the OSP finish, anti-oxidation treatment, and comprehensive electrical testing completed the workflow.

The production was executed over 7.8 days, yielding panels with consistent layer registration and reliable via integrity. This approach ensured the tight-geometry multilayer boards met all specified requirements for the customer.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
HDI-20260512-016 HDI PCB 4 63.5 x 127 Green ENIG (Immersion Gold) 10 View detail
HDI-20260422-051 HDI PCB 4 210 x 100 Green OSP 10 View detail
HDI-20260418-016 HDI PCB 4 162 x 73 Red ENIG (Immersion Gold) 20 View detail

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