PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Rigid-Flex PCB | Quantity | 10 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 133.69 x 160.84 mm | Copper Weight | 1OZ |
| Thickness | 0.8 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Matte Black | Silkscreen | White |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
We executed this multilayer rigid-flex PCB with tight control over hybrid material transitions. Precise layer stack alignment prior to flex-rigid lamination prevented registration drift and ensured reliable plated interconnects between rigid and dynamic flex zones.
Controlled depth routing was sequenced after solder mask and ENIG deposition to protect flex circuits while maintaining exact depth tolerance. Dynamic flex reliability testing under cyclic stress validated long-term mechanical integrity without compromising production flow.
The primary challenge of CTE mismatch during high-pressure lamination was managed through optimized temperature profiling and material staging. The complete order moved from engineering review to final electrical testing in 6.9 days with zero defects and full traceability.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| RFP-20260427-074 | Rigid-Flex PCB | 4 | 131.97 x 115.05 | Green | ENIG (Immersion Gold) | 260 | View detail |
| RFP-20260401-039 | Rigid-Flex PCB | 4 | 138 x 128 | Green | ENIG (Immersion Gold) | 5 | View detail |
| RFP-20260312-007 | Rigid-Flex PCB | 4 | 46 x 16 | Green | ENIG (Immersion Gold) | 20 | View detail |
