PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Rigid-Flex PCB | Quantity | 20 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 46 x 16 mm | Copper Weight | 1OZ |
| Thickness | 0.6 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order covered the fabrication of a rigid-flex PCB with a compact finished unit size of 46 mm × 16 mm. A total of 20 pieces were delivered in 5 panelized sets using a 2×2 layout per set on 106 mm × 46 mm panels. Rigid sections measured 0.6 mm ±0.1 mm thick on FR-4 (Shengyi S1150G, Tg155) with 1 OZ inner and outer copper; flexible sections used Shengyi SF305C polyimide at 0.15 mm ±0.05 mm with 1/3 OZ copper and single-sided yellow coverlay. The build included ENIG surface finish, impedance control, minimum 4 mil trace/space, and full flying-probe electrical test. Panelization incorporated 55 mm process edges, milling slots, bridges, stamp holes, fiducials, optical points, outer-layer grid copper, inner-layer copper blocks, and R1 corner rounding, with a maximum of two breakaways accepted per set.
During DFM review and EQ exchanges, targeted modifications were applied to improve manufacturability and reliability. Internal right-angle corners on the rigid board at the rigid-flex transition were changed to 0.5 mm radius fillets to reduce stress concentration and tearing risk during flexing. Vias initially closer than 0.6 mm to the flexible outline were relocated to maintain safe clearance and prevent chemical ingress or delamination. Silkscreen artwork was optimized by moving or removing characters that overlapped pads, with production executed on the adjusted yellow-plus-red graphics. Where pad spacing left insufficient solder-mask bridge width, open-window processing was adopted. Stackup confirmation aligned rigid thickness to the customer-specified 0.6 mm (adjusted from initial 0.8 mm data) and flex thickness to 0.15 mm; inner-layer copper was set to 18 µm (half-ounce) as recommended for the surface-flex configuration while outer layers remained 35 µm. Corresponding impedance values were recalculated and confirmed, and process-edge width was updated to 55 mm per customer requirement. All points were closed before release.
These engineering adjustments supported stable execution through lamination, drilling, plating, imaging, and surface finish. The panelized format with controlled breakaways delivered the full quantity while preserving board integrity. Production met IPC Class II criteria and completed on schedule.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| RFP-20260427-074 | Rigid-Flex PCB | 4 | 131.97 x 115.05 | Green | ENIG (Immersion Gold) | 260 | View detail |
| RFP-20260401-039 | Rigid-Flex PCB | 4 | 138 x 128 | Green | ENIG (Immersion Gold) | 5 | View detail |
| RFP-20251223-007 | Rigid-Flex PCB | 4 | 133.69 x 160.84 | Matte Black | ENIG (Immersion Gold) | 10 | View detail |
