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4 Layer Rigid-Flex PCB Production Record #RFP-20260401-039

Rigid-Flex PCB 4 Layers ENIG (Immersion Gold) Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 138 x 128 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Feb 06 16:16
Files Ready
Feb 06 16:16
Engineering Review Completed
Feb 06 17:17
Payment down
Feb 08 16:15
Production Started
Mar 16 17:37
Production Completed
Apr 01 14:51
Progress: 0/6
Engineering Review time: 0.8 h
Production time: 15.9d With Engineering Questions

Logistics Information

Production Completed→Shipping : 2 min
Carrier
FedEx IP
Destination
FRANCE
Shipping Method
Express Air
Shipping Time
Apr 01 14:53

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This 4-layer rigid-flex order measured 138 × 128 mm with a finished thickness of 1.6 mm and required five pieces. The design specified ENIG surface finish at 1.0 µm, 0.3 mm drilled holes, and via cover oil. Line and space were held at 6 mil. Inner-layer base copper was set at 0.5 oz and outer-layer finished copper at 1 oz, with hole wall copper at 22 µm. Shengyi material was used for both rigid and flex sections after confirming the stack-up and soft-hard boundary location.

 

During CAM review, the supplied gerber showed open windows on vias, board-outline size mismatch, right-angle corners on the flex outline, and several pads positioned too close to the final edge. The character frame line placed on the flex region was also removed. All open windows were closed to achieve via cover oil, the outline corners were filleted to R0.5 mm, external objects were deleted, and trace anomalies were corrected on the working files. These changes eliminated the risk of exposed copper after routing and prevented potential flex cracking at sharp corners. The same via cover oil and outline fillet adjustments applied here had been validated on prior rigid-flex builds.

 

After customer confirmation of the revised working files, the boards were released to production under IPC Class 2 criteria. Flying-probe testing confirmed electrical integrity on all five pieces, and the lot was shipped complete within the 24-day window with the required test reports and certificates.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260427-074 Rigid-Flex PCB 4 131.97 x 115.05 Green ENIG (Immersion Gold) 260 View detail
RFP-20260312-007 Rigid-Flex PCB 4 46 x 16 Green ENIG (Immersion Gold) 20 View detail
RFP-20251223-007 Rigid-Flex PCB 4 133.69 x 160.84 Matte Black ENIG (Immersion Gold) 10 View detail

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