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4 Layer Rigid-Flex PCB Production Record #RFP-20260429-041

Rigid-Flex PCB 4 Layers ENIG (Immersion Gold) Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 119.87 x 109.66 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Mar 23 08:20
Files Ready
Mar 23 08:20
Engineering Review Completed
Mar 23 09:05
Payment down
Apr 01 01:23
Production Started
Apr 01 01:25
Production Completed
Apr 27 10:10
Progress: 0/6
Engineering Review time: 10 min
Production time: 26.4d With Engineering Questions

Logistics Information

Production Completed→Shipping : 2.2d
Carrier
FedEx IP
Destination
ISRAEL
Shipping Method
Express Air
Shipping Time
Apr 29 14:56

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This production record covers five units of 4-layer rigid-flex PCB, sized at 119.87 × 109.66 mm with 1.0 mm finished thickness and 1 oz copper. The boards used 6/6 mil trace and spacing, 0.3 mm minimum holes, green soldermask, white silkscreen, and immersion gold ENIG finish. Material preparation and layer stack alignment received particular attention to ensure reliable bonding between rigid FR4 sections and flexible polyimide layers at the transition zones.

 

We performed flex-rigid lamination and high-pressure lamination under tightly controlled temperature profiles, followed by solder mask application, electroless nickel deposition, and immersion gold deposition. Controlled depth routing preserved the integrity of the flex areas while dynamic flex reliability testing verified bending endurance. Full electrical testing completed the sequence, confirming continuity and isolation across all five boards after the 26.4-day production cycle.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260427-010 Rigid-Flex PCB 4 131.97 x 115.05 Green ENIG (Immersion Gold) 260 View detail
RFP-20260401-039 Rigid-Flex PCB 4 138 x 128 Green ENIG (Immersion Gold) 5 View detail
RFP-20260312-073 Rigid-Flex PCB 4 46 x 16 Green ENIG (Immersion Gold) 20 View detail

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