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4 Layer Rigid-Flex PCB Production Record #RFP-20260608-0005

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 20 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 22.15 x 97.92 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
May 25 07:31
Files Ready
May 25 07:31
Engineering Review Completed
May 25 09:31
Payment down
May 25 09:31
Production Started
May 25 09:31
Production Completed
Jun 06 15:38
Progress: 0/6
Engineering Review time: 2 h
Production time: 12.3d

Logistics Information

Production Completed→Shipping : 2.1d
Carrier
UPS
Destination
INDONESIA
Shipping Method
Express Air
Shipping Time
Jun 08 15:57

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This production record covers 20 units of 4-layer rigid-flex PCBs measuring 22.15 × 97.92 mm with a finished thickness of 1.6 mm. The stackup employed 1 oz copper throughout, standard 6/6 mil trace width and spacing, and 0.3 mm minimum holes. Immersion gold ENIG surface finish was applied over green soldermask with white silkscreen, providing reliable contact surfaces while accommodating the transition zones between rigid and flexible regions.

 

Layer stack alignment and high-pressure lamination were followed by dedicated flex-rigid lamination to maintain registration across material types. Controlled depth routing produced clean outlines without damaging internal flex layers. Dynamic flex reliability testing subjected the bend areas to repeated cycles, confirming mechanical endurance, while 100 % electrical testing verified net continuity and isolation on every board.

 

The 12.3-day schedule allowed careful execution of each process step, resulting in uniform quality and consistent performance across the full lot.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail
RFP-20260429-041 Rigid-Flex PCB 4 119.87 x 109.66 Green ENIG (Immersion Gold) 5 View detail

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