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4 Layer Rigid-Flex PCB Production Record #RFP-20260606-0038

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 180 x 120 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Black Silkscreen White

Manufacturing Timeline

Order Created
May 07 11:32
Files Ready
May 07 11:32
Engineering Review Completed
May 08 11:35
Payment down
May 08 11:35
Production Started
May 08 11:35
Production Completed
Jun 05 15:14
Progress: 0/6
Engineering Review time: 1d
Production time: 28.2d

Logistics Information

Production Completed→Shipping : 1.1d
Carrier
FedEx IP
Destination
UNITED KINGDOM
Shipping Method
Express Air
Shipping Time
Jun 06 16:58

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

These five panelized 4-layer rigid-flex PCBs measured 180 by 120 mm with 1.6 mm finished thickness and 1 oz copper throughout. The build followed a standard 6/6 mil track and spacing geometry together with 0.3 mm minimum holes, black soldermask, white silkscreen, and immersion gold ENIG surface finish. No blind vias were required, allowing focus on the hybrid stackup where rigid FR4 sections transition into flexible layers.

 

Production began with detailed engineering review and material preparation matched to the rigid-flex construction. We performed precise layer stack alignment, high pressure lamination, and flex-rigid lamination to ensure stable bonding at the interfaces. Solder mask application preceded electroless nickel and immersion gold deposition, after which controlled depth routing accurately defined the flex regions without damaging adjacent circuitry.

 

Dynamic flex reliability testing confirmed the panels could endure repeated bending cycles, followed by full electrical testing that showed all boards within specification. The 28-day schedule permitted careful process monitoring for this low-volume order, yielding consistent mechanical and electrical performance suited for end-product integration.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260429-041 Rigid-Flex PCB 4 119.87 x 109.66 Green ENIG (Immersion Gold) 5 View detail

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