4 Layer Rigid-Flex PCB Production Record #RFP-20260723-038

For this order of 10 rigid-flex PCBs, production covered 4-layer panels measuring 186 × 111.6 mm with 1.6 mm finished thickness and 2 oz copper throughout. The specification used standard 6/6 mil track and spacing, 0.3 mm minimum holes, green soldermask, and immersion gold ENIG finish without silkscreen. These parameters required careful material pairing between FR4 rigid sections and flexible layers to maintain both mechanical endurance and current-carrying capacity across the panelized format.

Manufacturing followed a sequence of flex-rigid lamination, thick copper electroplating, and controlled depth routing to define the transition zones accurately. Layer stack alignment and high-pressure bonding ensured registration between dissimilar RFP materials, while dynamic flex reliability testing confirmed the panels could withstand repeated bending. The ENIG deposition provided uniform coverage suited to the 2 oz copper weight and exposed contact areas.

Full electrical testing verified continuity and isolation on every board. The 25-day schedule allowed thorough process controls at each stage, delivering consistent rigid-flex panels that met the specified electrical and mechanical requirements.