PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 100 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 80 x 88 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.25mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production run delivered 100 pieces of panelized 4-layer FR4 PCB, sized 80 × 88 mm at 1.6 mm thickness with 1 oz copper and a custom stackup. The design used standard 6/6 mil trace and spacing together with 0.25 mm minimum holes, green soldermask, white silkscreen, and immersion gold ENIG finish. Without impedance control requirements, the focus remained on maintaining registration and plating uniformity across the panels.
We executed engineering review, inner layer imaging, circuit etching, layer alignment, and high-pressure lamination in sequence. Solder mask application preceded electroless nickel deposition and immersion gold plating to secure consistent surface quality. These steps were carried out to match the specified parameters while preserving edge definition and interlayer bonding on every panel.
Electrical testing verified continuity and isolation for the full lot. Completed in 4.8 days, the order produced repeatable boards that satisfied all dimensional and finish criteria for this standard multilayer configuration.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |
