Coupons
Help
  • FAQ
    browse most common questions
  • Live Chat
    talk with our online service
  • Email
    contact your dedicated sales:

2 Layer FR4 PCB Production Record #FR4-20260630-014

FR4 PCB 2 Layers ENIG (Immersion Gold) Prototype
Start FR4 PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 10 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 126 x 145 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
May 13 22:05
Files Ready
Engineering Review Completed
May 13 22:21
Payment down
Jun 02 12:49
Production Started
Jun 02 12:49
Production Completed
Jun 30 10:32
Progress: 0/6
Engineering Review time: 0.3 h Multiple File Revisions
Production time: 28.0d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.2 h
Carrier
FedEx IP
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Jun 30 10:42

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Solder Mask Application
05
Electroless Nickel Deposition
06
Immersion Gold Deposition
07
Electrical Testing

Manufacturing Summary

This small-batch 2-layer FR-4 board (126 × 145 mm, 1.6 mm thick, TG150, 1 oz copper) was panelized 2×1 for 10 pieces total. The design used 5 mil line/space, immersion gold finish, green solder mask, and white silkscreen. Resin plugging was specified for vias, with 100% flying probe testing required. Process edges of 10 mm were added left and right, and mechanical forming completed the outline with V-cut + routing separation.

 

Extensive DFM coordination resolved several layout conflicts. Solder mask openings did not initially match copper features around IC pins and tight-pitch components, risking ink intrusion into PTH pads or broken solder mask bridges. Overlapping silkscreen and mask elements, mismatched outer dimensions in .gko layers, and fiducial/marking placements (including UL and E489133 logos) needed verification. Antenna areas were confirmed for solid copper pour, specific holes for plugged vias versus open mask, and stamp hole additions were aligned. Tight pad-to-hole clearances were adjusted to maintain both trace spacing and solder mask integrity.

 

All engineering questions were confirmed before release, enabling clean execution of the resin-plugged vias and precise gold plating. The limited 10-piece run was completed within the 11-day schedule, with full electrical test reports, quality certificates, and cross-section analysis delivered. Final boards satisfied the customer’s documentation and assembly requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260628-010 FR4 PCB 2 60 x 120 Green HASL Lead Free 5 View detail
FR4-20260619-010 FR4 PCB 2 121 x 121 Green HASL Lead Free 50 View detail
FR4-20260618-018 FR4 PCB 2 54.74 x 106.93 Green HASL Lead Free 5 View detail

2026 AIVON.COM All Rights Reserved
Intellectual Property Rights | Terms of Service | Privacy Policy | Refund Policy