PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 5 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 462.57 x 205 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Matte Black | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
The production record for five standard 4-layer FR4 panel PCBs measuring 462.57 mm by 205 mm highlights several specific considerations during manufacturing. With a board thickness of 1.6 mm, 1 oz copper weight, and tighter 5/5 mil track spacing, we conducted careful inner layer imaging and etching to achieve the required precision on this scale. Layer stack alignment received particular attention prior to high pressure lamination to maintain reliable via connections and layer registration without the use of blind vias.
Matte black soldermask combined with white silkscreen created the specified visual profile, while the immersion gold ENIG finish was deposited in a controlled sequence of electroless nickel and gold plating steps. This surface treatment supports excellent long-term solderability. Following solder mask application and surface finishing, we performed full electrical testing on all panels to verify netlist integrity.
The complete build cycle took four days and delivered panels meeting all dimensional and electrical criteria. This execution reflects the process controls applied to balance the panel size, minimum hole size of 0.2 mm, and overall specifications for dependable results.
This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→
Explore More PCB Manufacturing Resources
4 Layer FR4 PCB Manufacturing Insights
Discover how AIVON manufactures 4 Layer FR4 PCBs, including multilayer stackup design, layer alignment control, fabrication processes, manufacturing challenges, and real production experience from customer orders.
How to Avoid Common Engineering Queries in Multilayer FR4 PCB Design
Real multilayer FR4 PCB CAM review cases covering stack-up confirmation, impedance control, copper balance, via tenting, and edge clearance EQs. Discover practical DFM best practices for 4-layer and higher boards to reduce engineering queries, prevent warpage, and improve first-pass yield.
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260717-013 | FR4 PCB | 4 | 43.81 x 86.99 | Black | HASL Lead Free | 10 | View detail |
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260614-001 | FR4 PCB | 4 | 30.28 x 56.4 | Green | HASL Lead Free | 15 | View detail |
