4 Layer FR4 PCB Production Record #FR4-20260911-001

We began this order with a thorough engineering review of the 4-layer PCB design, confirming all parameters including the custom stackup for the 1.6mm thickness. Material preparation was followed by inner layer imaging, circuit etching, and precise layer stack alignment before high pressure lamination. These steps ensured solid interlayer bonding for the 10 boards, each measuring 76.33 x 49.91mm.

Green soldermask and white silkscreen were then applied according to specifications. For the surface finish, we utilized molten solder coating and hot air leveling to produce a reliable HASL Lead Free coating on the standard 4-layer FR4 PCB. With a minimum hole size of 0.2mm and 6/6mil trace spacing, the design fell within conventional parameters that support efficient fabrication.

Final electrical testing validated continuity and isolation across the complete batch. The entire manufacturing process took 2.6 days and resulted in boards that meet all dimensional and performance criteria. This execution demonstrates consistent quality suitable for prototype to small-volume requirements.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→